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Chen, Ji-an
465  Ergebnisse:
Buchkapitel (Online) X
englisch X
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1

Debonding Detection in Carbon Fiber Reinforced Polymer Plat..:

, In: 2022 International Conference on Cyber-Physical Social Intelligence (ICCSI),
Xu, Yong ; Chen, Ji-An ; Chen, Xuemin. - p. 152-156 , 2022
Link: https://doi.org/10.1109/..
 
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2

Solder Joint Reliability Assessment on FO-CSP for Next Gene..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Liu, Vance ; Chen, Jian-Ming ; Pan, Ji-An... - p. 969-972 , 2022
Link: https://doi.org/10.1109/..
 
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3

Contributors:

, In: Molecular and Laser Spectroscopy,
Agarwal, Nisha Rani ; Balasubramanian, Janani ; Beć, Krzysztof B.... - p. xxi-xxiv , 2022
Link: https://doi.org/10.1016/..
 
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4

Common Source Line-to-Word Line Short Improvement by Elimin..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chu, Yuan-Chieh ; Chang, Chih-Chin... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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5

Post-Etch Yield Killer Defects in 3D NAND High Aspect Ratio..:

, In: 2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Chih-Chin ; Hsiao, Ching-Hung ; Chen, Yi-Che... - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Improvement of Twisting and Line-Edge Roughness of 3D NAND ..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chung, Yao-An ; Chiu, Yuan-Chieh ; Chang, Yu-Fan... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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7

Thermal Design of SiC Power Module for EV/HEV Applications:

, In: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
Liu, Chun-Kai ; Po-Kai, Chiu ; Huang, Yuan-Cheng... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Machine learning Assists on High Aspect Ratio Slit Trench E..:

, In: 2022 33rd Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Chang, Yu-Fan ; Lee, Hong-Ji ; Chou, Fu-Hsing... - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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9

A Hybrid Approach to Equivalent Fault Identification for Ve..:

, In: Proceedings of the 2018 on Great Lakes Symposium on VLSI,
Wu, Chia-Cheng ; Lee, Tung-Yuan ; Lai, Yung-An... - p. 447-450 , 2018
Link: https://dl.acm.org/doi/1..
 
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10

Image Blending Methods for Defective PCB Image Generation:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Chiang, Ting-Hui ; Chang, Chun-Hao ; Chen, Li-Hsin... - p. 261-262 , 2022
Link: https://doi.org/10.1109/..
 
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11

Classification of Surface Natural Resources based On U-NET ..:

, In: 2020 17th International Computer Conference on Wavelet Active Media Technology and Information Processing (ICCWAMTIP),
Li, Mu-Jie ; Zhu, Ming-Cang ; Ma, Zhigang... - p. 179-182 , 2020
Link: https://doi.org/10.1109/..
 
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12

Low-Latency Quasi-Synchronous Transmission Technique for Mu..:

, In: 2007 IEEE International Symposium on Circuits and Systems (ISCAS),
Ye, Jhao-Ji ; Chen, You-Gang ; Wey, I-Chyn. - p. None , 2007
Link: https://doi.org/10.1109/..
 
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13

Navigating Real-World Challenges: A Quadruped Robot Guiding..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Cai, Shaojun ; Ram, Ashwin ; Gou, Zhengtai... - p. 1-18 , 2024
Link: https://dl.acm.org/doi/1..
 
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14

The Design of a Low-latency Tensor Decomposition Algorithm ..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chen, Yu-An ; Shen, Chung-An - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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15

Investigation of IGZO Thin Film Transistors with Copper Ele..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lee, Po-Yi ; Zhou, Kuan-Ju ; Chen, Yu-An.. - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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