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X
Sakamoto, Izumi
4  Ergebnisse:
Buchkapitel (Online) X
englisch X
Personensuche X
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1

A Temporary Bonding De-Bonding Tape with High Thermal Resis..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Sakamoto, Yuji ; Watanabe, Ryoichi ; Daido, Izumi. - p. 39-40 , 2023
Link: https://doi.org/10.23919..
 
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2

A Random Walk-Based Stochastic Distributed Exploration Algo..:

, In: 2024 IEEE/SICE International Symposium on System Integration (SII),
Sakamoto, Kosuke ; Sato, Toui ; Izumi, Kiyohisa... - p. 998-1003 , 2024
Link: https://doi.org/10.1109/..
 
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3

Motivation in Teaching Expert Development Project by KOSEN ..:

, In: 2023 IEEE Global Engineering Education Conference (EDUCON),
Yonemura, Keiichi ; Nakata, Ryotaro ; Kobayashi, Hideyuki... - p. 1-9 , 2023
Link: https://doi.org/10.1109/..
 
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4

Teaching Expert Development Project by KOSEN Security Educa..:

, In: 2022 IEEE Global Engineering Education Conference (EDUCON),
Yonemura, Keiichi ; Oyama, Shinya ; Kobayashi, Hideyuki... - p. 1643-1651 , 2022
Link: https://doi.org/10.1109/..
 
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