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2024 International Conference on Electronics Packaging (ICEP) ,
1
Investigation of Wafer Warpage Evolution Baesd on Fan-Out C..:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
2
Board-Level Drop Reliability Analysis for Fine-Pitch BGA Pa..:
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2023 International Conference on Electronics Packaging (ICEP) ,
3
Post-Buckling Analysis for Addressing Asymmetric Warping of..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
4
Development and Application of the Moisture-Dependent Visco..:
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Neuropathology of Drug Addictions and Substance Misuse ,
5
Single-Photon-Emission Computed Tomography Studies with Dop..:
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2021 IEEE International Conference on Consumer Electronics (ICCE) ,
6
Toward Free Head Motion for Visible-Spectrum Gaze Tracking ..:
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2019 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-TW) ,
8
A Chinese Oral Question-and-Answering System Based on LSTM:
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2011 7th International Wireless Communications and Mobile Computing Conference ,
9
A cooperative MAC protocol in multi-channel wireless ad hoc..:
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1994 International Conference on Parallel Processing Vol. 3 ,
10
Optimal Broadcast in All-Port Wormhole-Routed Hypercubes:
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2024 International Conference on Electronics Packaging (ICEP) ,
12
Solder Joint Reliability Comparison Under JEDEC Drop and Sy..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
13
High Acceleration Dynamic Methodology for Board-Level Shock..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
14
Evaluation of Vapor Pressure Induced Debonding Failure in F..:
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2024 International Conference on Electronics Packaging (ICEP) ,
15