E-LIB Suche - Ergebnisse für: Fu, Chien-Wei

1

Reconfigurable Intelligent Surface-Assisted Coordinated Mul..:

, In: 2024 IEEE International Conference on Consumer Electronics (ICCE),

Fu, Chien-Wei ; Ku, Meng-Lin ; Cai, Bing-Han. - p. 1-5 , 2024

Link: https://doi.org/10.1109/..

2

UAV Trajectory, User Association and Power Control for Mult..:

, In: 2023 VTS Asia Pacific Wireless Communications Symposium (APWCS),

Fu, Chien-Wei ; Ku, Meng-Lin - p. 1-5 , 2023

Link: https://doi.org/10.1109/..

3

Low N-Type Contact Resistance to Carbon Nanotubes in Highly..:

, In: 2023 International Electron Devices Meeting (IEDM),

Safron, Nathaniel ; Chiu, Hsin-Yuan ; Chao, Tzu-Ang... - p. 1-4 , 2023

Link: https://doi.org/10.1109/..

4

EOS Endurance Power Circuits without Depletion Mode Devices:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,

Huang, Shao-Chang ; Lee, Jian-Hsing ; Li, Ching-Ho... - p. 79-80 , 2022

Link: https://doi.org/10.1109/..

5

Polymer material grating used on contactless sub-wavelength..:

, In: The 9th IEEE International Conference on Nano/Micro Engineered and Molecular Systems (NEMS),

Tseng, Kuo-Chun ; Lin, Te-Hsun ; Modsching, Norbert.. - p. 592-595 , 2014

Link: https://doi.org/10.1109/..

6

A 3.96μm, 124dB Dynamic Range, 6.2mW Stacked Digital Pixel ..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),

Chen, Song ; Liu, Chiao ; Bainbridge, Lyle... - p. 1-2 , 2023

Link: https://doi.org/10.23919..

7

Flow Boiling Heat Transfer Performance Comparison of Skived..:

, In: 2023 39th Semiconductor Thermal Measurement, Modeling & Management Symposium (SEMI-THERM),

Lin, Fang-Chou ; Liu, Chien-Fu ; Yang, Ming-Tsung... - p. 1-5 , 2023

Link: https://doi.org/10.23919..

8

Maintenance of Prelarge High Average-Utility Patterns in In..:

, In: Trends in Artificial Intelligence Theory and Applications. Artificial Intelligence Practices; Lecture Notes in Computer Science,

Wu, Jimmy Ming-Tai ; Teng, Qian ; Lin, Jerry Chun-Wei.. - p. 884-895 , 2020

Link: https://doi.org/10.1007/..

9

Energy-balanced hole-movement mechanism for temporal full-c..:

, In: Proceedings of the 6th International Wireless Communications and Mobile Computing Conference,

Chang, Chih-Yung ; Chu, Wei-Cheng ; Lin, Chih-Yu. - p. 89-93 , 2010

Link: https://dl.acm.org/doi/1..

10

Power Load Forecasting Based on VMD and Attention-LSTM:

, In: Proceedings of the 3rd International Conference on Data Science and Information Technology,

Chao, Han-Chieh ; Lin, Fu ; Pan, Jeng-Shyang.. - p. 19-25 , 2020

Link: https://dl.acm.org/doi/1..

11

Study on Electronic Countermeasure of Notebook Computer HD ..:

, In: 2020 IEEE 2nd Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability (ECBIOS),

Chien, Wei ; Huang, Liang-Qing ; Chiu, Chien-Ching.. - p. 99-101 , 2020

Link: https://doi.org/10.1109/..

12

Research on the Circuit Layout of High-Definition Multimedi..:

, In: 2020 IEEE 2nd Eurasia Conference on Biomedical Engineering, Healthcare and Sustainability (ECBIOS),

Chien, Wei ; Chiu, Chien-Ching ; Hsiao, Chiuan-Fu. - p. 92-94 , 2020

Link: https://doi.org/10.1109/..

13

Big Data Analytics for Tool Health Monitoring in Panel Indu..:

, In: 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE),

Chen, Chia-Cheng ; Ting, Wei-Ju ; Chien, Chen-Fu - p. 127-129 , 2019

Link: https://doi.org/10.1109/..

14

Electronic Design Automation (EDA) Scheduling System in IC ..:

, In: 2019 IEEE International Conference on Smart Manufacturing, Industrial & Logistics Engineering (SMILE),

Zheng, Jia-Nian ; Chien, Chen-Fu ; Lin, Tzu-Yu.. - p. 221-225 , 2019

Link: https://doi.org/10.1109/..

15

An Anti-Plasma Etching Film of Y2O3 Film:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),

Wei, Chia-Chih ; Chen, Hsuan-Jung ; Lee, Yi-Mu.. - p. 87-89 , 2024

Link: https://doi.org/10.1109/..