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Ho, Tsung-wu
383  Ergebnisse:
Buchkapitel (Online) X
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1

A Lab-Based Investigation of Reaction Time and Reading Perf..:

, In: 14th International Conference on Automotive User Interfaces and Interactive Vehicular Applications,
Hsiung, Lei ; Chang, Yung-Ju ; Li, Wei-Ko.. - p. 96-107 , 2022
Link: https://dl.acm.org/doi/1..
 
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2

EDA Challenges for Memristor-Crossbar based Neuromorphic Co..:

, In: Proceedings of the 25th edition on Great Lakes Symposium on VLSI,
Liu, Beiye ; Wen, Wei ; Chen, Yiran... - p. 185-188 , 2015
Link: https://dl.acm.org/doi/1..
 
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3

An EDA framework for large scale hybrid neuromorphic comput..:

, In: Proceedings of the 52nd Annual Design Automation Conference,
Wen, Wei ; Wu, Chi-Ruo ; Hu, Xiaofang... - p. 1-6 , 2015
Link: https://dl.acm.org/doi/1..
 
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4

Common-Centroid FinFET Placement Considering the Impact of ..:

, In: Proceedings of the 2015 Symposium on International Symposium on Physical Design,
Wu, Po-Hsun ; Lin, Mark Po-Hung ; Li, Xin. - p. 25-31 , 2015
Link: https://dl.acm.org/doi/1..
 
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5

A thermal resilient integration of many-core microprocessor..:

, In: Proceedings of the conference on Design, Automation & Test in Europe,
Wu, Sih-Sian ; Wang, Kanwen ; Sai Manoj, P. D.... - p. 1-4 , 2014
Link: https://dl.acm.org/doi/1..
 
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6

A thermal resilient integration of many-core microprocessor..:

, In: 2014 Design, Automation & Test in Europe Conference & Exhibition (DATE),
Wu, Sih-Sian ; Wang, Kanwen ; Sai, Manoj P. D.... - p. 1-4 , 2014
Link: https://doi.org/10.7873/..
 
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7

Performance-driven analog placement considering monotonic c..:

, In: Proceedings of the International Conference on Computer-Aided Design,
Wu, Po-Hsun ; Lin, Mark Po-Hung ; Chen, Yang-Ru... - p. 613-619 , 2012
Link: https://dl.acm.org/doi/1..
 
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8

Thermal-aware bus-driven floorplanning:

, In: Proceedings of the 17th IEEE/ACM international symposium on Low-power electronics and design,
Wu, Po-Hsun ; Ho, Tsung-Yi - p. 205-210 , 2011
Link: https://dl.acm.org/doi/1..
 
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9

Bus-pin-aware bus-driven floorplanning:

, In: Proceedings of the 20th symposium on Great lakes symposium on VLSI,
Wu, Bo-Shiun ; Ho, Tsung-Yi - p. 27-32 , 2010
Link: https://dl.acm.org/doi/1..
 
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10

Dynamic IR-Drop Prediction of At-Speed Two-Vector Tests Usi..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wu, Yu-Tsung ; Liang, Zhe-Jia ; Hsieh, Chao-Ho... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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11

Low-IR-Drop Test Pattern Regeneration Using A Fast Predicto:

, In: 2022 23rd International Symposium on Quality Electronic Design (ISQED),
Liu, Shi-Tang ; Chen, Jia-Xian ; Wu, Yu-Tsung... - p. 27-32 , 2022
Link: https://doi.org/10.1109/..
 
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12

License Plate Recognition for Moving Vehicles Using a Movin..:

, In: 2013 Ninth International Conference on Intelligent Information Hiding and Multimedia Signal Processing,
Chen, Chao-Ho ; Chen, Tsong-Yi ; Wu, Min-Tsung.. - p. 497-500 , 2013
Link: https://doi.org/10.1109/..
 
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13

A 28nm Nonvolatile AI Edge Processor using 4Mb Analog-Based..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Wen, Tai-Hao ; Hung, Je-Min ; Hsu, Hung-Hsi... - p. 1-2 , 2023
Link: https://doi.org/10.23919..
 
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14

A Low Complexity Monocular Image Matching Scheme for Effici..:

, In: 2022 IEEE International Conference on Consumer Electronics (ICCE),
Wu, Jia-Cheng ; Luo, Min-Jia ; Hwang, Yin-Tsung. - p. 1-4 , 2022
Link: https://doi.org/10.1109/..
 
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15

A Heterogeneously Integrated Wafer-level Processed Co-Packa..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Nair Gourikutty, Sajay Bhuvanendran ; Long, Lau Boon ; Wei, Seit Wen... - p. 207-211 , 2023
Link: https://doi.org/10.1109/..
 
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