Ich stimme zu, dass diese Seite Cookies verwende. Weitere Informationen finden Sie unter unseren Datenschutzerklärungen .
X
Kim, Aaron Taehwan
42  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
?
1

Efficient Blood Pressure Estimation Using Seismocardiogram ..:

, In: 2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Han, Seungju ; Kim, Changhee ; Kim, Taehwan. - p. 884-887 , 2024
Link: https://doi.org/10.1109/..
 
?
2

Optimal Placement of Foot Pressure Sensors for Lower-Limb E..:

, In: 2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Song, Ha-Yoon ; Chung, Hyun-Joon ; Jeon, Kwang-Woo... - p. 150-153 , 2024
Link: https://doi.org/10.1109/..
 
?
3

Totoro: A Scalable Federated Learning Engine for the Edge:

, In: Proceedings of the Nineteenth European Conference on Computer Systems,
Ching, Cheng-Wei ; Chen, Xin ; Kim, Taehwan... - p. 182-199 , 2024
Link: https://dl.acm.org/doi/1..
 
?
4

Effective Slogan Generation with Noise Perturbation:

, In: Proceedings of the 32nd ACM International Conference on Information and Knowledge Management,
Kim, Jongeun ; Kim, MinChung ; Kim, Taehwan - p. 3998-4002 , 2023
Link: https://dl.acm.org/doi/1..
 
?
5

Thermal Improvement of HBM with Joint Thermal Resistance Re..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kim, Taehwan ; Lee, Jonggyu ; Kim, Youngdeuk... - p. 767-771 , 2023
Link: https://doi.org/10.1109/..
 
?
6

integrated dual-polarization silicon photonic transceiver w..:

, In: 2023 Optical Fiber Communications Conference and Exhibition (OFC),
Wu, Xinru ; Huang, Duanni ; Kim, Taehwan... - p. 1-3 , 2023
Link: https://doi.org/10.1364/..
 
?
7

Enhancement of Thermal Transient Prediction Accuracy for Mo..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Park, Hwanjoo ; Kim, Taehwan ; Kang, Sunggu... - p. 1339-1343 , 2023
Link: https://doi.org/10.1109/..
 
?
8

A Real-Time Keyword Spotting System Based on an End-To-End ..:

, In: 2023 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS),
Yoon, Jinsung ; Lee, Donghyun ; Kim, Neungyun... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
?
9

Testing Geopolymer Concrete Performance in Chloride Environ..:

, In: International RILEM Conference on Synergising Expertise towards Sustainability and Robustness of Cement-based Materials and Concrete Structures; RILEM Bookseries,
Nguyen, Quang Dieu ; De Carvalho Gomes, Samuel ; Alnahhal, Mohammed Fouad... - p. 1197-1203 , 2023
Link: https://doi.org/10.1007/..
 
?
10

Generating Realistic Images from In-the-wild Sounds:

, In: 2023 IEEE/CVF International Conference on Computer Vision (ICCV),
Lee, Taegyeong ; Kang, Jeonghun ; Kim, Hyeonyu. - p. 7126-7136 , 2023
Link: https://doi.org/10.1109/..
 
?
11

A 3D-integrated 8λ × 32 Gbps λ Silicon Photonic Microring-b..:

, In: 2023 IEEE Custom Integrated Circuits Conference (CICC),
Levy, Cooper ; Xuan, Zhe ; Huang, Duanni... - p. 1-2 , 2023
Link: https://doi.org/10.1109/..
 
?
12

Source-Line Shared SOT-MRAM Cell for Energy Efficient Read ..:

, In: 2022 19th International SoC Design Conference (ISOCC),
Kim, Taehwan ; Park, Jongsun - p. 3-4 , 2022
Link: https://doi.org/10.1109/..
 
?
13

A Reconfigurable Inference Processor for Recurrent Neural N..:

, In: 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC),
Kim, Jiho ; Park, Kwoanyoung ; Kim, Tae-Hwan - p. 94-95 , 2022
Link: https://doi.org/10.1109/..
 
?
14

BiMDiM: Area efficient Bi-directional MRAM Digital in-Memor..:

, In: 2022 IEEE 4th International Conference on Artificial Intelligence Circuits and Systems (AICAS),
Kim, Dongsu ; Jang, Yunho ; Kim, Taehwan. - p. 74-77 , 2022
Link: https://doi.org/10.1109/..
 
?
15

Thermal Modeling and Analysis of High Bandwidth Memory in 2..:

, In: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm),
Kim, Taehwan ; Lee, Jonggyu ; Kim, Jaechoon... - p. 1-5 , 2022
Link: https://doi.org/10.1109/..
 
1-15