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27th International Conference on Electricity Distribution (CIRED 2023) ,
1
A validation of IED for networked distribution system:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
2
Image Performance Evaluation of a Mobile DTS System Using a..:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
3
Development of a Diode-based Symmetric Charge Division Circ..:
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2023 International Electron Devices Meeting (IEDM) ,
4
<1ppm Device to Chip Level Reliability Characterization for..:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
5
Deep Learning Based Scatter Correction for TOF-PET:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
6
Experimental studies of ionization-induced modulation of op..:
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2023 IEEE Nuclear Science Symposium, Medical Imaging Conference and International Symposium on Room-Temperature Semiconductor Detectors (NSS MIC RTSD) ,
7
High-Q Plasmonic Resonance Modes for Purcell Enhanced Scint..:
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27th International Conference on Electricity Distribution (CIRED 2023) ,
8
Power quality analysis of LVDC distribution system using re..:
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2022 IEEE Hot Chips 34 Symposium (HCS) ,
9
Scaling of Memory Performance and Capacity with CXL Memory ..:
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2022 22nd International Conference on Control, Automation and Systems (ICCAS) ,
10
T-S fuzzy controller design for Rotary Inverted Pendulum wi..:
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2022 International Conference on Electronics Packaging (ICEP) ,
11
Impact of Backside Defects on Device Characteristics of Ult..:
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CIRED Porto Workshop 2022: E-mobility and power distribution systems ,
12
Development of AI-based integrated control system for safet..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
13
Comprehensive Feasibility Study of Single FIN Transistors f..:
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2021 IEEE International Electron Devices Meeting (IEDM) ,
14
28nm CIS-Compatible Embedded STT-MRAM for Frame Buffer Memo..:
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Vibration Engineering for a Sustainable Future ,
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