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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
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Damage Mechanisms of Tight Sandstone Reservoirs Induced by ..:
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2023 26th International Conference on Electrical Machines and Systems (ICEMS) ,
2
Analysis and Optimization of Permanent Magnet-Assisted Sync..:
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Atlas of Cleft Lip and Palate & Facial Deformity Surgery ,
3
Surgical Instruments of Cleft Lip and Palate:
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2007 International Conference on Computational Intelligence and Security Workshops (CISW 2007) ,
4
A Research on the Steganography Capacity of the Reed-Solomo..:
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Intelligent Computing Theories and Application; Lecture Notes in Computer Science ,
5
SHDC: A Method of Similarity Measurement Using Heat Kernel ..:
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2007 IEEE International Conference on Industrial Engineering and Engineering Management ,
6
A method of optimum product platform parameters planning:
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2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
7
Case Study of SIMS Analysis on Insulators:
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2022 4th International Academic Exchange Conference on Science and Technology Innovation (IAECST) ,
8
Research on the input-output evaluation method of power gri..:
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Springer Series in Geomechanics and Geoengineering; Proceedings of the International Field Exploration and Development Conference 2023 ,
9
Evaluation and Recognition of Fracturing Effect in Ultra-Lo..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
11
A combined simulation and experimental study on cracking an..:
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Springer Proceedings in Physics; Proceedings of the 23rd Pacific Basin Nuclear Conference, Volume 3 ,
12
Low Temperature Performance of LBE Oxygen Sensors with Diff..:
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2023 International Conference on Cyber-Physical Social Intelligence (ICCSI) ,
13
Research on Operation State Evaluation of Power Plant Key T..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
A Comprehensive Study of Crack Initiation and Delamination ..:
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2022 23rd International Conference on Electronic Packaging Technology (ICEPT) ,
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