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An, Wen-han
976  Ergebnisse:
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1

Sci-Tech Business Incubator - Favorable Network Operation M..:

, In: 2019 IEEE International Conference on Service Operations and Logistics, and Informatics (SOLI),
Wen-Si, Han ; Jia-Long, Xie - p. 65-69 , 2019
Link: https://doi.org/10.1109/..
 
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2

Fine Pitch (≤ 10μm) Die to Wafer Cu-Cu TCB on Organic Polym..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Harish, Vineeth ; Sahoo, Krutikesh ; Zheng, Kai... - p. 2178-2183 , 2024
Link: https://doi.org/10.1109/..
 
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3

Signal & Power Integrity Optimization Utilizing Silicon Cor..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ayers, Seann ; Verhaverbeke, Steven ; Chen, Han-Wen.. - p. 279-284 , 2024
Link: https://doi.org/10.1109/..
 
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4

Distributed Shor's Algorithm with Sequential Quantum Telepo..:

, In: 2023 IEEE 5th Eurasia Conference on IOT, Communication and Engineering (ECICE),
Jiang, Jehn-Ruey ; Wang, Ting-Yuan ; Huang, Wen-Han. - p. 479-484 , 2023
Link: https://doi.org/10.1109/..
 
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5

A digital 3D TCAM accelerator for the inference phase of Ra..:

, In: 2023 60th ACM/IEEE Design Automation Conference (DAC),
Tsai, Chieh-Lin ; Wu, Chun-Feng ; Chang, Yuan-Hao... - p. 1-6 , 2023
Link: https://doi.org/10.1109/..
 
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6

Pedestrian Intent Prediction by Dense Graph Transformer:

, In: 2022 IEEE International Conference on Consumer Electronics - Taiwan,
Chen, Oscal Tzyh-Chiang ; Liu, Han-Wen ; Chang, Yu-Lung. - p. 585-586 , 2022
Link: https://doi.org/10.1109/..
 
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7

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Novel CMP Material Solution To Enable High Removal Rate Die..:

, In: 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC),
Chakraborty, Tapash ; Verhaverbeke, Steven ; Chen, Han-Wen. - p. 540-541 , 2022
Link: https://doi.org/10.1109/..
 
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9

Universal Delay Compensation for Model Predictive Current C..:

, In: 2022 Asia Power and Electrical Technology Conference (APET),
Chen, Dong-Hai ; Chen, Han-Wen ; Qiu, Yu-Tao... - p. 225-230 , 2022
Link: https://doi.org/10.1109/..
 
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10

Personalized Taiwanese Speech Synthesis using Cascaded ASR ..:

, In: 2022 32nd International Conference Radioelektronika (RADIOELEKTRONIKA),
Liao, Yuan-Fu ; Hsu, Wen-Han ; Pan, Chen-Ming... - p. 01-05 , 2022
Link: https://doi.org/10.1109/..
 
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11

Room Temperature Cu-Cu Direct Bonding Using Wetting/Passiva..:

, In: 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
Hong, Zhong-Jie ; Liu, Demin ; Hsieh, Shu-Ting... - p. 387-388 , 2022
Link: https://doi.org/10.1109/..
 
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12

Input-to-state stabilization for a 2 × 2 hyperbolic system ..:

, In: 2022 37th Youth Academic Annual Conference of Chinese Association of Automation (YAC),
Zhang, Han-Wen ; Wang, Jun-Min ; Wang, Jing - p. 296-301 , 2022
Link: https://doi.org/10.1109/..
 
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13

ICE: An Intelligent Cognition Engine with 3D NAND-based In-..:

, In: 2022 55th IEEE/ACM International Symposium on Microarchitecture (MICRO),
Hu, Han-Wen ; Wang, Wei-Chen ; Chang, Yuan-Hao... - p. 763-783 , 2022
Link: https://doi.org/10.1109/..
 
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14

A 512Gb In-Memory-Computing 3D-NAND Flash Supporting Simila..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Hu, Han-Wen ; Wang, Wei-Chen ; Chen, Chung-Kuang... - p. 138-140 , 2022
Link: https://doi.org/10.1109/..
 
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15

Investigation of Low Temperature Co-Co Direct Bonding and C..:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Liu, Demin ; Mei, Kuan-Chun ; Hu, Han-Wen... - p. 187-193 , 2022
Link: https://doi.org/10.1109/..
 
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