Bardon, J.
23  Ergebnisse:
Personensuche X
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1

Identity and Power in Organizational Theory:

, In: The Oxford handbook of identities in organizations / edited by Andrew D. Brown
Link: https://doi.org/10.1093/..

Exemplar:  Zentrale:E02 a soz 596.5/799
 
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2

Afterword: Directions for Science Communication:

, In: The Truth About Denial,
Bardon, Adrian - p. 295-324 , 2019
 
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3

Science Denial:

, In: The Truth About Denial,
Bardon, Adrian - p. 67-126 , 2019
 
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4

Religion:

, In: The Truth About Denial,
Bardon, Adrian - p. 213-294 , 2019
 
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5

Bias and Belief:

, In: The Truth About Denial,
Bardon, Adrian - p. 1-66 , 2019
 
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6

Pride, Prejudice, and Political Economy:

, In: The Truth About Denial,
Bardon, Adrian - p. 127-212 , 2019
 
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7

Micro-augmentations : situated calibration of a novel no..:

, In: Proceedings of the 19th Panhellenic Conference on Informatics,
 
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8

Fern Acylphloroglucinols: Structure, Location, and Biologic..:

, In: Bioactive Natural Products; Studies in Natural Products Chemistry,
 
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9

Contributors:

, In: Current Therapy in Colon and Rectal Surgery,
 
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11

Backside Power Delivery: Game Changer and Key Enabler of Ad..:

, In: 2023 International Electron Devices Meeting (IEDM),
Veloso, A. ; Vermeersch, B. ; Chen, R.... - p. 1-4 , 2023
 
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12

3D Stacked Devices and MOL Innovations for Post-Nanosheet C..:

, In: 2023 International Electron Devices Meeting (IEDM),
Horiguchi, N. ; Mertens, H. ; Chiarella, T.... - p. 1-4 , 2023
 
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13

Design exploration of IGZO diode based VCMA array design fo..:

, In: ESSDERC 2022 - IEEE 52nd European Solid-State Device Research Conference (ESSDERC),
Gupta, M. ; Perumkunnil, M. ; Fantini, A.... - p. 241-244 , 2022
 
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14

Failure Analysis for SIP IC after TC reliability test:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Cui, Bardon - p. 1-4 , 2022
 
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15

Failure Analysis for SIP IC EOS fail:

, In: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA),
Cui, Bardon ; You, Qiquan - p. 1-4 , 2022
 
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