Chen, JJ
5  Ergebnisse:
Personensuche X
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1

Fan-Out RDL-first Panel-Level Packaging for Heterogeneous I..:

, In: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC),
Lau, John H ; Ko, Cheng-Ta ; Yang, Kai-Ming... - p. 339-347 , 2020
 
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2

Session details: System-level power and reliability estimat..:

, In: Proceedings of the Conference on Design, Automation and Test in Europe,
 
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3

Session details: System-level optimization of embedded real..:

, In: Proceedings of the Conference on Design, Automation and Test in Europe,
 
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4

Curriculum Based Multi-Task Learning for Parkinson's Diseas..:

, In: 2023 IEEE 20th International Symposium on Biomedical Imaging (ISBI),
 
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5

Comparison of Anatomical and Diffusion MRI for detecting Pa..:

, In: 2023 45th Annual International Conference of the IEEE Engineering in Medicine & Biology Society (EMBC),
 
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