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Koji Yoshida
30  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Structure and Dynamics of Liquids Investigated by Quantum B..:

, In: Molecular Basics of Liquids and Liquid-Based Materials; Physical Chemistry in Action,
Yoshida, Koji - p. 73-115 , 2021
Link: https://doi.org/10.1007/..
 
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2

Development of Flexible Tracked Vehicle d-FlexCraw: Evaluat..:

, In: 2020 IEEE/SICE International Symposium on System Integration (SII),
Kinugasa, Tetsuya ; Osuka, Koichi ; Miyamoto, Naoki.. - p. 743-746 , 2020
Link: https://doi.org/10.1109/..
 
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3

Frequency analysis of heart rate variability with equalized..:

, In: 2020 IEEE/SICE International Symposium on System Integration (SII),
Yoshida, Koji ; Wada, Kazuyoshi - p. 980-984 , 2020
Link: https://doi.org/10.1109/..
 
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4

Coexistence of ferromagnetism with superconductivity in RuS..:

, In: EPR in the 21st Century,
Yoshida, Koji ; Nakamura, Masatoshi ; Higashi, Naoto. - p. 151-156 , 2002
Link: https://doi.org/10.1016/..
 
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5

Low-Complexity Cross-Domain Iterative Detection Based on Lo..:

, In: 2024 IEEE International Conference on Communications Workshops (ICC Workshops),
Yoshida, Takumi ; Takahashi, Takumi ; Ishibashi, Koji - p. 402-407 , 2024
Link: https://doi.org/10.1109/..
 
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6

Thermal stress reliability comparison of WB and POL-kW stru..:

, In: 2023 IEEE Applied Power Electronics Conference and Exposition (APEC),
Nishihara, Youichi ; Bando, Koji ; Hayashibe, Shingo... - p. 1150-1154 , 2023
Link: https://doi.org/10.1109/..
 
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7

Effect of Ni additive on electroless Cu quality for high de..:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Zhang, Zheng ; Hsieh, Ming-Chun ; Nishijima, Masahiko... - p. 155-156 , 2023
Link: https://doi.org/10.23919..
 
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8

Study of Cu Micro-via by TOF-SIMS and STEM:

, In: 2023 International Conference on Electronics Packaging (ICEP),
Nishijima, Masahiko ; Hsieh, Ming-Chun ; Zheng, Zhang... - p. 151-152 , 2023
Link: https://doi.org/10.23919..
 
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9

Federated Learning with Client Selection in Resource-Uncert..:

, In: Engineering Cyber-Physical Systems and Critical Infrastructures; Advances in Engineering and Information Science Toward Smart City and Beyond,
Yoshida, Naoya ; Nishio, Takayuki ; Yamamoto, Koji. - p. 223-243 , 2023
Link: https://doi.org/10.1007/..
 
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10

Fine Pitch Micro Via Interconnection with Reliable Electrol..:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Hsieh, Ming-Chun ; Zhang, Zheng ; Nishijima, Masahiko... - p. 1381-1384 , 2023
Link: https://doi.org/10.1109/..
 
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11

Overmodulation Technique on Common Mode Voltage Reduction P..:

, In: 2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia),
Kashihara, Tatsuki ; Araki, Yushi ; Yoshida, Hiroshi. - p. 741-745 , 2022
Link: https://doi.org/10.23919..
 
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12

Enhancement of Supercontinuum Generation with Multimode Exc..:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Yoshida, Koki ; Ishizawa, Atsushi ; Kou, Rai... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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13

Contributors:

, In: Sodium-cooled Fast Reactors,
Aizawa, Kosuke ; Ando, Masanori ; Ashida, Takashi... - p. vii-xii , 2022
Link: https://doi.org/10.1016/..
 
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14

10 J, 100 Hz, 1 kW Conductive-Cooled Active-Mirror Laser:

, In: 2022 Conference on Lasers and Electro-Optics Pacific Rim (CLEO-PR),
Ogino, Jumpei ; Tsubakimoto, Koji ; Yoshida, Hidetsugu... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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15

Simple method of carrier-envelope-offset locking with f-3f ..:

, In: 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC),
Ishizawa, Atsushi ; Kawashima, Kota ; Kou, Rai... - p. 1-1 , 2021
Link: https://doi.org/10.1109/..
 
1-15