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2015 IEEE 16th Annual Wireless and Microwave Technology Conference (WAMICON) ,
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Wideband 3 dB quadrature microstrip line coupler with unequ..:
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2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) ,
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Low Height Wire bond Looping Technology using Wedge Bonding..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
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Development of a Next Generation Stretchable Substrate for ..:
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2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) ,
4
Hybrid Solder with silver hierarchical structure and partic..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
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Evaluation of Crack Propagation at the Interconnection Inte..:
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2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
6
Study on the Embedded Flexible Hybrid Stack Package using P..:
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2019 IEEE 4th International Future Energy Electronics Conference (IFEEC) ,
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Hybrid Current Mode Control for Phase-Shift Full-Bridge Con..:
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2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) ,
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Design and Analysis of Flexible Interconnects on an Extreme..:
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2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) ,
10
Study of intermetallic compound growth and failure mechanis..:
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Conference Record of the Twenty-Sixth International Power Modulator Symposium, 2004 and 2004 High-Voltage Workshop. ,
12
Development of a 75 Coulomb triggered vacuum switch:
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2024 IEEE Transportation Electrification Conference and Expo (ITEC) ,
13
A new test method for estimating rotor resistance of induct..:
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2023 IEEE Energy Conversion Congress and Exposition (ECCE) ,
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Experimental comparison of induction motor and IPMSM with i..:
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2022 International Electron Devices Meeting (IEDM) ,
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