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X
Stęplewski, Wojciech
3  Ergebnisse:
Buchkapitel (Online) X
Personensuche X
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1

Interconnect Stress Testing as a Tool for Assessment of Rel..:

, In: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Glinski, Krzysztof ; Ostaszewski, Dariusz... - p. 1-5 , 2023
Link: https://doi.org/10.23919..
 
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2

Comparison of SAC and new Pb-free solder alloy for special ..:

, In: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC),
Arazna, Aneta ; Koscielski, Marek ; Sitek, Anna... - p. 1-6 , 2020
Link: https://doi.org/10.1109/..
 
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3

Recovery of valuable BGA components from used electronic mo..:

, In: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC),
Koscielski, Marek ; Sitek, Janusz ; Ciszewski, Piotr... - p. 1-5 , 2019
Link: https://doi.org/10.23919..
 
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