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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Key Technologies and Design Aspects for Wafer Level Packagi..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
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Wafer Level Capping Technology for Vacuum Packaging of Micr..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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Fabrication and Characterization of Nanoporous Gold (NPG) I..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
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High Density Thin Film Flex Technology for Advanced Packagi..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
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