Xiandong, Li
31  results:
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1

Study on the Effect of Pulse Parameters on Nano-Copper Elec..:

, In: 2023 International Conference on Power System Technology (PowerCon),
Yunlong, Liu ; Weiyang, Zheng ; Xiandong, Li... - p. 1-6 , 2023
 
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2

Intelligent transportation operation and maintenance integr..:

, In: 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP),
Yao, Lijuan ; Li, Xiandong - p. 947-950 , 2023
 
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3

Resilience Improvement Strategy of Distribution Network in ..:

, In: 2023 8th International Conference on Power and Renewable Energy (ICPRE),
Li, Xiandong - p. 1390-1395 , 2023
 
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4

Design and Implementation of VRRP and BFD Linkage Technolog..:

, In: Proceedings of the 2023 4th International Conference on Machine Learning and Computer Application,
Niu, Yu ; Li, Xiandong - p. 197-201 , 2023
 
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5

High-Voltage Nanosecond Pulse Generator Based on DSRD Serie..:

, In: 2023 8th International Conference on Power and Renewable Energy (ICPRE),
Liu, Yunlong ; Yu, Liang ; Li, Xiandong... - p. 1054-1057 , 2023
 
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6

Application of virtual simulation technology in campus netw..:

, In: 2022 International Conference on Informatics, Networking and Computing (ICINC),
Li, Xiandong ; Li, Jie ; Yao, Lijuan - p. 224-227 , 2022
 
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7

Application of data acquisition and intelligent analysis in..:

, In: 2022 4th International Conference on Intelligent Control, Measurement and Signal Processing (ICMSP),
Yao, Lijuan ; Li, Xiandong ; Li, Jie. - p. 1111-1114 , 2022
 
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8

High threshold voltage GaN HEMT with mixed conductive chann..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Li, Wanjie ; Tao, Luqi ; Wang, Liming... - p. 1-4 , 2020
 
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9

Simulation Study of GaN-based Trench CAVET with p-Shielded ..:

, In: 2020 21st International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Xu ; Chen, Xianping ; Li, Wanjie... - p. 1-4 , 2020
 
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10

A Survey of Deep Learning and Its Application in Distributi..:

, In: 2020 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Yin, Xiaomin ; Li, Xiandong ; Zhang, Yan... - p. 643-646 , 2020
 
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11

Effect of pressure on nano copper sintering in interconnect..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Qian, Jing ; Chen, Xianping ; Tan, Chunjian... - p. 1-4 , 2019
 
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12

The Simulation Study of Ohmic Contact at GaN- HEMT Devices ..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Zhang, Xu ; Chen, Xianping ; Wang, Liming... - p. 1-4 , 2019
 
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13

Study on single-event burnout of SiC VDMOSFET: failure mech..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Qiumei ; Chen, Xianping ; Luo, Houcai... - p. 1-5 , 2019
 
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14

Gate and barrier layer design of E-mode GaN HEMT with p-GaN..:

, In: 2019 20th International Conference on Electronic Packaging Technology(ICEPT),
Li, Wanjie ; Chen, Xianping ; Wang, Liming... - p. 1-4 , 2019
 
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15

Design and Research on the Integration of Gamification Desi..:

, In: Design, User Experience, and Usability; Lecture Notes in Computer Science,
Ju, Zhenze ; Li, ZiYang ; Cheng, XianDong. - p. 104-116 , 2024
 
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