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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
Multi-tier die stacking through collective die-to-wafer hyb..:
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Proceedings of the Nineteenth International Conference on Artificial Intelligence and Law ,
3
Justification, stability and relevance for case-based reaso..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer ..:
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2023 Optical Fiber Communications Conference and Exhibition (OFC) ,
5
Highly Optimized O-band Si Ring Modulators for Low-Power Hy..:
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2023 IEEE PES Innovative Smart Grid Technologies Europe (ISGT EUROPE) ,
6
Voltage Support and Electrical Stresses in MMC-HVDC Systems..:
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Communications in Computer and Information Science; Explainable Artificial Intelligence ,
7
Explaining Model Behavior with Global Causal Analysis:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
8
Integration of plasma dicing in the collective die to wafer..:
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2023 IEEE PES Innovative Smart Grid Technologies Europe (ISGT EUROPE) ,
9
Seasonal Performance of Fitted Q-iteration for Space Heatin..:
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Proceedings of the Nineteenth International Conference on Artificial Intelligence and Law ,
10
Model- and data-agnostic justifications with A Fortiori Cas..:
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Extended Abstracts of the 2022 CHI Conference on Human Factors in Computing Systems ,
11
Effect of Anthropomorphic Glyph Design on the Accuracy of C..:
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2022 32nd International Conference on Field-Programmable Logic and Applications (FPL) ,
12
Mining CryptoNight-Haven on the Varium C1100 Blockchain Acc..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
13
Carrier Systems for Collective Die-to-Wafer Bonding:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
14
Cost-effective RF interposer platform on low-resistivity Si..:
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2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) ,
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