?
HCI in Business, Government and Organizations; Lecture Notes in Computer Science ,
1
Building a "Corpus of 7 Types Emotion Co-occurrences Words"..:
, In:
?
Sustainable Development of Water and Environment; Environmental Science and Engineering ,
2
Using Thermal Desorption Technique to Treat Real Field Dies..:
, In:
?
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
3
Optimizing Device Metal Routing Layouts by the Simulation T..:
, In:
?
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
4
A Combination of Implant Shadow and Skin Effects Leading to..:
, In:
?
2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) ,
5
RESURF Region Variation Induced Current Crowding Effect on ..:
, In:
?
2023 IEEE International Reliability Physics Symposium (IRPS) ,
6
A Concise Electrothermal Model to Characterize the Thermal ..:
, In:
?
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
7
Transmission Line Pulse Width Impacting on Device Performan..:
, In:
?
2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
8
Bipolar Transistors' Holding Phenomena:
, In:
?
2022 IEEE International Reliability Physics Symposium (IRPS) ,
9
Incorporation of a Simple ESD Circuit in a 650V E-Mode GaN ..:
, In:
?
2022 IEEE International Conference on Consumer Electronics - Taiwan ,
10
EOS Endurance Power Circuits without Depletion Mode Devices:
, In:
?
2022 IEEE International Conference on Consumer Electronics - Taiwan ,
11
Gate Voltages Impacting on Latch-up Measurements:
, In:
?
2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
12
The Correlations between ESD and TLP in Large Array Devices:
, In:
?
2020 IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) ,
13
Signal Control Switching for Improving Large Array Devices'..:
, In:
?
2017 International Conference on Applied System Innovation (ICASI) ,
14
Investigating the design parameters on the multi-layer micr..:
, In:
?
2015 IEEE International Symposium on Circuits and Systems (ISCAS) ,
15