Hsiao-Fan Chen
464  results:
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1

Message from the ComManTel 2014 chairs:

, In: 2014 International Conference on Computing, Management and Telecommunications (ComManTel),
 
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2

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
 
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4

A Machine Learning Study to Obtain an Optimal Processing Pu..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
 
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5

Optimizing Device Metal Routing Layouts by the Simulation T..:

, In: 2023 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan),
Huang, Shao-Chang ; Li, Ching-Ho ; Liao, Chih-Cherng... - p. 219-220 , 2023
 
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6

A 22nm 4Mb STT-MRAM Data-Encrypted Near-Memory Computation ..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Chiu, Yen-Cheng ; Yang, Chia-Sheng ; Teng, Shih-Hsin... - p. 178-180 , 2022
 
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7

Optimal Operation of Reservoir Power Generation Based on Im..:

, In: Advances in Intelligent Systems and Computing; Advanced Machine Learning Technologies and Applications,
Chen, Ran-Fan ; Chang, Kuo-Chi ; Chu, Kai-Chun... - p. 987-996 , 2021
 
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9

13.4 A 22nm 1Mb 1024b-Read and Near-Memory-Computing Dual-M..:

, In: 2020 IEEE International Solid- State Circuits Conference - (ISSCC),
Chang, Tung-Cheng ; Chiu, Yen-Cheng ; Lee, Chun-Ying... - p. 224-226 , 2020
 
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10

List of contributors:

, In: Translational Radiation Oncology,
Aaron, Daniel ; Abrams, Ross A. ; Agarwal, Mohit S.... - p. xi-xvi , 2023
 
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11

A 22nm 832Kb Hybrid-Domain Floating-Point SRAM In-Memory-Co..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Ping-Chun ; Su, Jian-Wei ; Hong, Li-Yang... - p. 126-128 , 2023
 
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12

A 28nm 1Mb Time-Domain Computing-in-Memory 6T-SRAM Macro wi..:

, In: 2022 IEEE International Solid- State Circuits Conference (ISSCC),
Wu, Ping-Chun ; Su, Jian-Wei ; Chung, Yen-Lin... - p. 1-3 , 2022
 
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13

Design Technology Co-Optimization for Cold CMOS Benefits in..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chiang, Hung-Li ; Wu, Jui-Jen ; Chou, Chen-Han... - p. 13.2.1-13.2.4 , 2021
 
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14

FrameTalk: Human and Picture Frame Interaction Through the ..:

, In: Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering; IoT as a Service,
Lai, Wen-Shu ; Lin, Yi-Bing ; Hsiao, Chung-Yun... - p. 3-11 , 2019
 
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15

The physics of Cu pillar bump interconnect under electromig..:

, In: Proceedings of the 5th Electronics System-integration Technology Conference (ESTC),
 
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