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Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering ,
1
Application and System of High-Temperature Plasma Gasificat..:
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2022 Asia Power and Electrical Technology Conference (APET) ,
2
Universal Delay Compensation for Model Predictive Current C..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
3
Superb sinterability of the Cu paste consisting of bimodal ..:
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Proceedings of the International Field Exploration and Development Conference 2021; Springer Series in Geomechanics and Geoengineering ,
4
Exploitation of Geothermal Energy by Installing Gravity Hea..:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
Fabrication of wearable strain sensor by using a novel hybr..:
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2021 22nd International Conference on Electronic Packaging Technology (ICEPT) ,
6
Fabrication of Flexible Printed Circuits on Polyimide Subst..:
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Communications in Computer and Information Science; Blockchain and Trustworthy Systems ,
7
A Data Integrity Verification Scheme Based on Blockchain an..:
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC) ,
8
A highly reliable die bonding approach for high power devic..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
9
A bimodal core–shell structured Cu–Ag nanoparticles based c..:
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2019 20th International Conference on Electronic Packaging Technology(ICEPT) ,
10
Effects of size distributions of copper nanoparticles on th..:
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International Conference on Biomedical and Health Informatics; IFMBE Proceedings ,
11
Relative Analysis Between Curative Effect Evaluation and El..:
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Lecture Notes in Mathematics; Topological Fixed Point Theory and Applications ,
12
Braids and periodic solutions:
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2019 IEEE/ASME International Conference on Advanced Intelligent Mechatronics (AIM) ,
13
Underwater Cage Boundary Detection Based on GLCM Features b..:
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Water Security: Big Data-Driven Risk Identification, Assessment and Control of Emerging Contaminants ,
14
List of contributors:
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2020 21st International Conference on Electronic Packaging Technology (ICEPT) ,
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