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2024 International Conference on Electronics Packaging (ICEP) ,
1
High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2023 24th International Conference on Electronic Packaging Technology (ICEPT) ,
2
High Speed SerDes Design on Flip Chip Package Substrate:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
3
Machine Learning in Integrated Circuit Substrate Electrical..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
4
A 32Gb/s Equalizer with Adaptive T-Coil Input Matching and ..:
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2008 30th Annual International Conference of the IEEE Engineering in Medicine and Biology Society ,
6
NO gas sensor of PEDOT: PSS nanowires by using direct patte..:
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2022 IEEE International Conference on Consumer Electronics - Taiwan ,
7
EOS Endurance Power Circuits without Depletion Mode Devices:
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2022 IEEE Asian Solid-State Circuits Conference (A-SSCC) ,
8
A Learning-Based Algorithm for Early Floorplan With Flexibl..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
9
A 28nm 1Mb Time-Domain Computing-in-Memory 6T-SRAM Macro wi..:
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2019 8th International Conference on Innovation, Communication and Engineering (ICICE) ,
10
An Efficient Recognition Method for Watermelon using Faster..:
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Lecture Notes in Networks and Systems; Advances in Information and Communication ,
11
Exceeding the Performance of Two-Tier Fat-Tree: Equality Ne..:
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2016 Eighth International Conference on Advanced Computational Intelligence (ICACI) ,
12
The research on developing the expert system of road paveme..:
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Proceedings of the 33rd Annual ACM Conference on Human Factors in Computing Systems ,
13
SoberDiary : A Phone-based Support System for Assisting ..:
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Proceedings of the 43rd annual Design Automation Conference ,
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