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X
Hsu, Ting-Hsuan
318  results:
Bookchapter (Online) X
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1

A YOLO-Based Method for Oblique Car License Plate Detection..:

, In: 2021 IEEE/ACIS 22nd International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD),
Li, Wei-Chen ; Hsu, Ting-Hsuan ; Huang, Ke-Nung. - p. 134-137 , 2021
Link: https://doi.org/10.1109/..
 
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2

A Pi-Based Beehive IoT System Design:

, In: Security with Intelligent Computing and Big-data Services; Advances in Intelligent Systems and Computing,
Chen, Yi-Liang ; Chien, Hung-Yu ; Hsu, Ting-Hsuan... - p. 535-543 , 2019
Link: https://doi.org/10.1007/..
 
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3

A High-Efficiency Wireless Power Transfer System With Varia..:

, In: 2024 IEEE Wireless Power Technology Conference and Expo (WPTCE),
Lai, Ching-Ming ; Hsu, Ching-Hsuan ; Lin, Yi-Chen.. - p. 688-692 , 2024
Link: https://doi.org/10.1109/..
 
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4

Agricultural Knowledge Discovery Based on Interpretable Mac..:

, In: 2024 4th International Conference on Computer Communication and Artificial Intelligence (CCAI),
Hsu, Hao-Hsuan ; Huang, Nen-Fu ; Tsai, Woan-Yuh... - p. 231-237 , 2024
Link: https://doi.org/10.1109/..
 
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5

A Simulation Study of Scaling Capability toward 10nm for th..:

, In: 2023 IEEE International Memory Workshop (IMW),
Chen, Wei-Chen ; Lue, Hang-Ting ; Hsu, Tzu-Hsuan.. - p. 1-4 , 2023
Link: https://doi.org/10.1109/..
 
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6

Medical Integrated Development Platform Based on Community ..:

, In: 2023 9th International Conference on Applied System Innovation (ICASI),
Lin, Jhe-Wei ; Siao, Cheng-Yan ; Chien, Ting-Hsuan.. - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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7

A 3D Stackable DRAM: Capacitor-less Three-Wordline Gate-Con..:

, In: 2022 International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Wu, Meng-Yan... - p. 26.3.1-26.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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8

Analog Computing in Memory (CIM) Technique for General Matr..:

, In: 2022 International Electron Devices Meeting (IEDM),
Wei, Ming-Liang ; Lue, Hang-Ting ; Ho, Shu-Yin... - p. 33.3.1-33.3.4 , 2022
Link: https://doi.org/10.1109/..
 
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9

Study of Analog Weights Based Computing-in-Memory (CIM) usi..:

, In: 2022 IEEE Silicon Nanoelectronics Workshop (SNW),
Lue, Hang-Ting ; Fu, Chung-Hao ; Hsu, Tzu-Hsuan... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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10

Biomimetic Functional Surface as Anti-corrosion Coating Lay..:

, In: 2022 IET International Conference on Engineering Technologies and Applications (IET-ICETA),
Tsai, Chau-Yi ; Chen, Yi-Seng ; Ke, Da-You... - p. 1-2 , 2022
Link: https://doi.org/10.1109/..
 
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11

Investigation of Factorized Optical Flows as Mid-Level Repr..:

, In: 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS),
Yang, Hsuan-Kung ; Hsiao, Tsu-Ching ; Liao, Ting-Hsuan... - p. 746-753 , 2022
Link: https://doi.org/10.1109/..
 
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12

Investigation of Methods That Greatly Improve 3D NOR Flash ..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Lo, Chieh... - p. 10.3.1-10.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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13

First Theoretical Modeling of the Bandgap-Engineered Oxynit..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Chen, Wei-Chen ; Lue, Hang-Ting ; Fan, Sheng-Ting... - p. 8.3.1-8.3.4 , 2021
Link: https://doi.org/10.1109/..
 
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14

A Vertical 2T NOR (V2T) Architecture to Enable Scaling and ..:

, In: 2020 IEEE Symposium on VLSI Technology,
Lue, Hang-Ting ; Hsu, Tzu-Hsuan ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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15

An Extremely Scaled Hemi-Cylindrical (HC) 3D NAND Device wi..:

, In: 2020 IEEE Symposium on VLSI Technology,
Du, Pei-Ying ; Lue, Hang-Ting ; Yeh, Teng-Hao... - p. 1-2 , 2020
Link: https://doi.org/10.1109/..
 
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