?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
1
A Low-Cost Antenna-in-Package (AiP) for D-Band Application:
, In:
?
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
2
Mitigate Package Level Crosstalk Using Tabbed Design:
, In:
?
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Creative Design and Structure Applied to Chiplets Packaging:
, In:
?
2023 IEEE CPMT Symposium Japan (ICSJ) ,
4
Crosstalk Mitigation for High Speed SerDes Applications on ..:
, In:
?
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
5
A planar High-efficient W-band Substrate-Integrated-Wavegui..:
, In:
?
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
7
A Study of Material Extraction and Moisture Effect on mmWav..:
, In:
?
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ,
8
Extraction of Complex Permittivity of Dielectrics on Packag..:
, In:
?
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
9
High Speed SerDes Design on FOCoS with Thick RDL:
, In:
?
2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility (EMC Sapporo/APEMC) ,
10
Study on Temperature Impact of the Dielectric Material Loss..:
, In:
?
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
11
Ultra High Density Package Design and Electrical Analysis i..:
, In:
?
2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ,
12
A 77GHz Antenna-in-Package with Low-Cost Solution for Autom..:
, In:
?
2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
13
The Comparison of Package Design and Electrical Analysis in..:
, In:
?
2024 International Conference on Electronics Packaging (ICEP) ,
14
High Speed D2D Interface Applied on Advanced Package:
, In:
?
2022 International Conference on Electronics Packaging (ICEP) ,
15