Ni, Xiaochen
3  results:
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1

Transient liquid phase bonding of Sn-Pb solder with added N..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Yao, Quanbin ; Lin, Pengrong... - p. 1-6 , 2022
 
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2

SIP: Boosting Up Graph Computing by Separating the Irregula..:

, In: Proceedings of the 2020 on Great Lakes Symposium on VLSI,
 
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3

Topologically protected one-way edge mode in networks of ac..:

, In: 2016 Progress in Electromagnetic Research Symposium (PIERS),
Xu Ni ; Cheng He ; Xiao-Chen Sun.. - p. 804-804 , 2016
 
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