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2022 IEEE Hot Chips 34 Symposium (HCS) ,
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LightTrader : World's first AI-enabled High-Frequency Tradi..:
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Proceedings of the 1st International Conference on Numerical Modelling in Engineering; Lecture Notes in Civil Engineering ,
3
Behaviour of Adjacent Ground and Existing Tunnel According ..:
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2009 IEEE International Reliability Physics Symposium ,
4
Systematic study on bias temperature instability of various..:
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2022 IEEE International Solid- State Circuits Conference (ISSCC) ,
7
A 16Gb 27Gb/s/pin T-coil based GDDR6 DRAM with Merged-MUX T..:
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Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing; Studies in Computational Intelligence ,
9
The Effects of Product's Visual Preview and Customer Review..:
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ,
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Effective Substrate Thermal Conductivity Modeling Method Ex..:
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2019 Electrical Design of Advanced Packaging and Systems (EDAPS) ,
11
Electrical and Thermal Co-Analysis of Thermally Efficient S..:
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2008 Flexible Electronics and Displays Conference and Exhibition ,
12
Development of Plasma-Damage Free Neutral Beam Sputtering S..:
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Springer Series in Reliability Engineering; Advances in Reliability and Maintainability Methods and Engineering Applications ,
14
Statistical Reliability Modeling and Analysis for Repairabl..:
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) ,
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