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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) ,
1
Investigation of Aluminum and Gold Flip-Chip Bonding for Qu..:
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2015 21st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) ,
2
Thermo — Mechanical characterization and reliability modell..:
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2006 1st Electronic Systemintegration Technology Conference ,
3
Identifying the Reliability Affecting Parameters of SBB Fli..:
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Deutsche Gesellschaft für Chirurgie; Chirurgisches Forum 2000 für experimentelle und klinische Forschung ,
4