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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Electromigration Failure Mechanisms of Cu-Cu Joints at Low ..:
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2024 International Conference on Electronics Packaging (ICEP) ,
2
Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
4
Comparison of Organic and Inorganic Dielectric Hybrid Bondi..:
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2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) ,
7
High Temperature Mechanical Properties of Nano-twinned Copp..:
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2024 International Conference on Electronics Packaging (ICEP) ,
11
Surface Modification by Wet Treatment for Low-Temperature C..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
12
Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:
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2024 International Conference on Electronics Packaging (ICEP) ,
13
The Enhancement in the Reliability of Nanotwinned Cu Redist..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
15