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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
2
3D interconnects for quantum computing:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
3
Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
4
20 μm pitch Cu-to-Cu flip-chip interconnects through Cu nan..:
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2024 International Conference on Electronics Packaging (ICEP) ,
6
Plasma Cleaning and Thermal Compression Bonding of Indium B..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
7
Process Development and Characterization of Ru-based UBM fo..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Wet Cu passivation for high throughput fluxless Thermal Com..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
9
Process Challenges During CVD Oxide Deposition on the Backs..:
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2023 IEEE 41st VLSI Test Symposium (VTS) ,
11
IP Session on Chiplet: Design, Assembly, and Test:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
12
Low temperature backside damascene processing on temporary ..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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Confined IMCs for low temperature and high throughput D2W b..:
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2022 International Conference on Electronics Packaging (ICEP) ,
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