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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
Integrated Design Ecosystem for Chiplets Heterogeneous Inte..:
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2023 International Conference on Electronics Packaging (ICEP) ,
2
Semiconductor Package Design Flow and Platform Applied on F..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
3
Advanced Packaging Design Platform for Chiplets and Heterog..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
4
Deep Learning based Refinement for Package Substrate Routin:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
5
Creative Design and Structure Applied to Chiplets Packaging:
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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ,
6
Advanced Fanout Packaging Technology for Hybrid Substrate I..:
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2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) ,
7
Ultra High Density Package Design and Electrical Analysis i..:
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC) ,
8