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Chao, Ching-Hsiang
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1

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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2

Alignment and Transfer of Silver Nanowire Arrays onto Uncon..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yen-Shuo ; Liu, Shun-Yu ; Lin, Ching-Chang... - p. 255-256 , 2024
Link: https://doi.org/10.23919..
 
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3

Implementing a Flexible IIoT Service Framework with Microse..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Chen, Wen-Ching ; Ji, Bo-Yu ; Chen, Hung-Hsiang.. - p. 110-115 , 2024
Link: https://doi.org/10.1109/..
 
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4

Distinguishing Handwritten from Printed Content on Quiz She..:

, In: Proceedings of the 2024 9th International Conference on Multimedia and Image Processing,
Wei, Yu-Jen ; Liu, Chen ; Chang, Ching-Hsiang. - p. 113-118 , 2024
Link: https://dl.acm.org/doi/1..
 
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5

Advanced Fan-Out Embedded Chip Process Integration for 3D A..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsiao, Chih-Cheng ; Hsu, Chao-Kai ; Li, Ching-Iang... - p. 181-182 , 2024
Link: https://doi.org/10.23919..
 
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6

Candle-Light Quantum-Dot Light-Emitting Electrochemical Cel..:

, In: 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD),
Shen, Hsiang-Ling ; Lu, Chin-Wei ; Yang, Zu-Po. - p. 82-85 , 2024
Link: https://doi.org/10.23919..
 
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7

Application of Generative Adversarial Network for Electroma..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Wu, Hung-Yu ; Chen, Po-Hsiang ; Chiu, Chien-Ching. - p. 672-674 , 2024
Link: https://doi.org/10.1109/..
 
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8

Towards System-Friendly Solid-State Circuit Breaker for Ele..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Qin, Dehao ; Zhang, Zheyu ; Dam, Shimul K... - p. 3108-3114 , 2024
Link: https://doi.org/10.1109/..
 
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9

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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10

Inverse Scattering of Two-dimensional Circular Cylindrical ..:

, In: 2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB),
Chen, Po-Hsiang ; Hsu, Hsiu-Hui ; Chiu, Chien-Ching.. - p. 504-506 , 2024
Link: https://doi.org/10.1109/..
 
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11

Contributors:

, In: Federated Learning,
Agussurja, Lucas ; Aramoon, Omid ; Arora, Sanjeev... - p. xvii-xxi , 2024
Link: https://doi.org/10.1016/..
 
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12

COVID-19 Control and Prevention in Taipei: A Data-Driven Ap..:

, In: Proceedings of the 25th Annual International Conference on Digital Government Research,
Yu, Hsuan-Ta ; Chiu, Yichun ; Chen, Hui-Min... - p. 258-268 , 2024
Link: https://dl.acm.org/doi/1..
 
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13

0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Ma, Kai ; Bekiaris, Nikolaos ; Hsu, Ching-Hsiang... - p. 331-336 , 2024
Link: https://doi.org/10.1109/..
 
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14

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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15

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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