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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
1
A Novel Detection Applied on Micro Defect in Bump Interface..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Alignment and Transfer of Silver Nanowire Arrays onto Uncon..:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
3
Implementing a Flexible IIoT Service Framework with Microse..:
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Proceedings of the 2024 9th International Conference on Multimedia and Image Processing ,
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Distinguishing Handwritten from Printed Content on Quiz She..:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Advanced Fan-Out Embedded Chip Process Integration for 3D A..:
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2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) ,
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Candle-Light Quantum-Dot Light-Emitting Electrochemical Cel..:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
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Application of Generative Adversarial Network for Electroma..:
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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
8
Towards System-Friendly Solid-State Circuit Breaker for Ele..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
9
Thermal resistance prediction model for IC packaging optimi..:
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2024 IEEE 4th International Conference on Electronic Communications, Internet of Things and Big Data (ICEIB) ,
10
Inverse Scattering of Two-dimensional Circular Cylindrical ..:
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Proceedings of the 25th Annual International Conference on Digital Government Research ,
12
COVID-19 Control and Prevention in Taipei: A Data-Driven Ap..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
13
0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatu..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
14
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
15