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2024 International Conference on Electronics Packaging (ICEP) ,
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Quantitative Elemental Characterization for Electroless Cu ..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
3
Enhancing EM Reliability and Lifetime Modeling: A Multi-Lin..:
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Engineering Cyber-Physical Systems and Critical Infrastructures; Artificial Intelligence for Internet of Things (IoT) and Health Systems Operability ,
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Covid-19 Detection Based on Chest X-ray Images Using Attent..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Eng..:
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2024 29th Asia and South Pacific Design Automation Conference (ASP-DAC) ,
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PRESS: Persistence Relaxation for Efficient and Secure Data..:
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ACM SIGGRAPH 2024 Immersive Pavilion ,
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FlowZen: Using Hybrid-Haptic and Particle for Enhancing Imm..:
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2024 International Conference on Electronics Packaging (ICEP) ,
8
High Performance Antenna-in-Package with Test Socket for Mi..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
9
A Compact mmWave 1x4 Antenna Array Design with Shorted Para..:
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Proceedings of the 2024 International Symposium on Physical Design ,
10
Reinforcement Learning or Simulated Annealing for Analog Pl..:
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2024 IEEE International Reliability Physics Symposium (IRPS) ,
11
Vmin Shift Prediction Using Machine Learning-Based Methodol..:
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2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI) ,
12
Research on Optical Axis Adjustment Method of Three-band Op..:
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Computer and Information Science and Engineering; Studies in Computational Intelligence ,
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Ball Trajectory and Landing Point Prediction Model Based on..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
14
Low DRAM Memory Access and Flexible Dataflow Convolutional ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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