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Chih-Hung Lin
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1

High Speed Signal Design on Fan-Out RDL Interposer for Arti..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Zhuang, Ming-Han ; Shih, Chih-Yuan ; Lin, Ho-Chuan.. - p. 275-276 , 2024
Link: https://doi.org/10.23919..
 
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2

Modified Architecture of an Intuitionistic Fuzzy Neural Net..:

, In: 2024 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE),
Huang, Kuan-Ming ; Lin, Tsung-Chih - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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3

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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4

AN INTELLIGENT SHOPPING-GUIDE SYSTEM BASED ON THE AIDA RULE:

, In: Proceedings of the 2024 International Conference on Information Technology, Data Science, and Optimization,
Hung, Lun-Ping ; Tsai, Wen-Lung ; Yeh, Ming-Kuei.. - p. 57-60 , 2024
Link: https://dl.acm.org/doi/1..
 
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5

FincGAN: A Gan Framework of Imbalanced Node Classification ..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Hsu, Hung Chun ; Lin, Ting-Le ; Wu, Bo-Jun... - p. 5750-5754 , 2024
Link: https://doi.org/10.1109/..
 
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6

Cultural Differences in Landing Page Informational Design o..:

, In: HCI International 2024 Posters; Communications in Computer and Information Science,
Lin, Chih-Yen ; Chiu, Tseng-Ping - p. 30-40 , 2024
Link: https://doi.org/10.1007/..
 
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7

Design of an Efficient Deep Neural Network Accelerator Base..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Hsiao, Shen-Fu ; Lin, Sin-Chen ; Chen, Guan-Lin... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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8

Refining Accuracy: A Quasi-Floating Channel SPICE Model for..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Hsu, Fu-Jen ; Chang, Ting-Fu ; Hung, Hsiang-Ting.. - p. 72-75 , 2024
Link: https://doi.org/10.1109/..
 
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9

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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10

BoostMVSNeRFs: Boosting MVS-based NeRFs to Generalizable Vi..:

, In: ACM SIGGRAPH 2024 Conference Papers,
Su, Chih-Hai ; Hu, Chih-Yao ; Tsai, Shr-Ruei... - p. 1-12 , 2024
Link: https://dl.acm.org/doi/1..
 
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11

Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Huai-En ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 816-820 , 2024
Link: https://doi.org/10.1109/..
 
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12

Utilizing Cabarzole/Bicarbazole-based A-D-A Small Molecules..:

, In: 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD),
Lin, Chun-Yu ; Jiang, Bing-Huang ; Weng, Pei-Jui... - p. 123-126 , 2024
Link: https://doi.org/10.23919..
 
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13

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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14

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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15

Performance Comparison of Direct Digital Control and DQ-bas..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Wu, Tasi-Fu ; Hung, Chien-Chih ; Kumari, Anumeha.. - p. 1888-1892 , 2024
Link: https://doi.org/10.1109/..
 
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