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2024 International Conference on Electronics Packaging (ICEP) ,
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High Speed Signal Design on Fan-Out RDL Interposer for Arti..:
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2024 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE) ,
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Modified Architecture of an Intuitionistic Fuzzy Neural Net..:
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2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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The Constraint Artificial-Intelligence Assisted Method for ..:
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Proceedings of the 2024 International Conference on Information Technology, Data Science, and Optimization ,
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AN INTELLIGENT SHOPPING-GUIDE SYSTEM BASED ON THE AIDA RULE:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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FincGAN: A Gan Framework of Imbalanced Node Classification ..:
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HCI International 2024 Posters; Communications in Computer and Information Science ,
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Cultural Differences in Landing Page Informational Design o..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
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Design of an Efficient Deep Neural Network Accelerator Base..:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
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Refining Accuracy: A Quasi-Floating Channel SPICE Model for..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Void Migration Kinetics in Fine Line Cu RDL under Electric ..:
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ACM SIGGRAPH 2024 Conference Papers ,
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BoostMVSNeRFs: Boosting MVS-based NeRFs to Generalizable Vi..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:
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2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD) ,
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Utilizing Cabarzole/Bicarbazole-based A-D-A Small Molecules..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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High Acceleration Dynamic Methodology for Board-Level Shock..:
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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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