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Cho, Seong-Jun
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1

9.6 A 6th-Order Quadrature CTDSM using Double-OTA and Quadr..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jongmi ; Cho, Seong-Eun ; Lee, Jaehoon... - p. 178-180 , 2024
Link: https://doi.org/10.1109/..
 
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2

ThanosKV: A Holistic Approach to Utilize NVM for LSM-tree b..:

, In: 2024 IEEE International Conference on Big Data and Smart Computing (BigComp),
Zhao, Guangxun ; Shin, Hojin ; Yoo, Seehwan.. - p. 143-150 , 2024
Link: https://doi.org/10.1109/..
 
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3

4.3 A 43mm2 Fully Integrated Legacy Cellular and 5G FR1 RF ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Bae, Jeongyeol ; Lee, Sangsung ; Lee, Joonggeun... - p. 80-82 , 2024
Link: https://doi.org/10.1109/..
 
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4

13.2 A 32Gb 8.0Gb/s/pin DDR5 SDRAM with a Symmetric-Mosaic ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Choi, Ikjoon ; Hong, Seunghwan ; Kim, Kihyun... - p. 234-236 , 2024
Link: https://doi.org/10.1109/..
 
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5

15.4 Self-Enabled Write-Assist Cells for High-Density SRAM ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Yeo, Minjune ; Cho, Keonhee ; Kim, Giseok... - p. 282-284 , 2024
Link: https://doi.org/10.1109/..
 
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6

High Performance Dynamic Voltage Restorer with Harmonic Com..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Liu, Ancheng ; An, Jun-Jae ; Go, Hyeon-Uk.. - p. 4464-4468 , 2024
Link: https://doi.org/10.1109/..
 
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7

Robustness to Device Degradation in Silicon FeFET-based Res..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Toprasertpong, Kasidit ; Nako, Eishin ; Min, Shin-Yi... - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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8

Tiered Storage in Modern Key-Value Stores: Performance, Sto..:

, In: 2024 IEEE International Conference on Big Data and Smart Computing (BigComp),
Jaranilla, Charles ; Shin, Hojin ; Yoo, Seehwan.. - p. 151-158 , 2024
Link: https://doi.org/10.1109/..
 
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9

13.4 A 48GB 16-High 1280GB/s HBM3E DRAM with All-Around Pow..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lee, Jinhyung ; Cho, Kyungjun ; Lee, Chang Kwon... - p. 238-240 , 2024
Link: https://doi.org/10.1109/..
 
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10

Lightweight Multi-Input Shape CNN-based Application Traffic..:

, In: NOMS 2024-2024 IEEE Network Operations and Management Symposium,
Baek, Ui-Jun ; Lee, Min-Seong ; Park, Jee-Tae... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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11

Enhancing GAN-Based Motion Data Augmentation Through Dynami..:

, In: 2024 International Conference on Artificial Intelligence in Information and Communication (ICAIIC),
Yoon, Junwon ; Chung, Hyun-Joon ; Kang, Jeon-Seong... - p. 440-445 , 2024
Link: https://doi.org/10.1109/..
 
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12

Study of Lubricant Compatibility with a Low-GWP Refrigerant..:

, In: Springer Proceedings in Energy; 13th International Conference on Compressors and Their Systems,
Oh, Bong Seong ; Lee, Gilbong ; Choi, Bongsu... - p. 857-866 , 2024
Link: https://doi.org/10.1007/..
 
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13

Material and structural approaches for human-machine interf..:

, In: Smart and Connected Wearable Electronics,
Park, Chan ; Lee, Byeongjun ; Kim, Jungmin... - p. 227-290 , 2024
Link: https://doi.org/10.1016/..
 
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14

Experimental Investigation of Adsorption Water Treatment Pr..:

, In: Lecture Notes in Civil Engineering; Resource Recovery from Wastewater Treatment,
Kim, Jun-Sik ; Woo, Seong-Yong ; Kim, Young-Deuk - p. 70-75 , 2024
Link: https://doi.org/10.1007/..
 
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15

Contributors:

, In: Smart and Connected Wearable Electronics,
Ban, Jonghyeon ; Brown, Matthew S. ; Cheng, Huanyu... - p. ix-xi , 2024
Link: https://doi.org/10.1016/..
 
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