Dinh, D. K.
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1

EM-Thermal Correlation Technologies for Industrial-Testing ..:

, In: 2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS),
Wane, S. ; Dinh, T.V. ; Alkhalifeh, K.... - p. 1-6 , 2024
 
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2

Multi-Beamforming Using Metasurface-Antenna Co-Designed wit..:

, In: 2024 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS),
Wane, S. ; Dinh, T.V. ; Bodehou, M.... - p. 1-6 , 2024
 
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3

List of contributors:

, In: Hydro-Meteorological Hazards, Risks, and Disasters,
Alex, Nimusiima ; Balbi, Stefano ; Balica, S.F.... - p. xiii-xv , 2023
 
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4

Mathematical and Numerical Modeling of Slope Stability for ..:

, In: Progress in Landslide Research and Technology, Volume 2 Issue 1, 2023; Progress in Landslide Research and Technology,
 
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5

Contributors:

, In: Current Developments in Biotechnology and Bioengineering,
 
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6

Artificial Intelligence for Safety Related Aviation Systems..:

, In: Information Systems Research in Vietnam, Volume 2,
Bernabeo, A. ; Goundar, S. ; Nguyen, K. V.... - p. 37-52 , 2023
 
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7

HierSFL: Local Differential Privacy-Aided Split Federated L..:

, In: 2023 IEEE Virtual Conference on Communications (VCC),
Quan, Minh K. ; Nguyen, Dinh C. ; Nguyen, Van-Dinh... - p. 103-108 , 2023
 
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8

Combined Thermo-Reflectance and Thin-Film Coating in Near-F..:

, In: 2023 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS),
Wane, S. ; Kendig, D. ; Dinh, T.V.... - p. 1-6 , 2023
 
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9

How Digital Payment Applications and Digital Trust Response..:

, In: Proceedings of the 8th International Conference on Industrial and Business Engineering,
Chen, James K.C. ; Lin, Pei-Kuan ; Aminah, Hania.. - p. 369-374 , 2022
 
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10

Contributors:

, In: Nanomaterials for Electrocatalysis,
Boruah, Tribani ; Cai, Weiwei ; Cui, Xun... - p. xv-xviii , 2022
 
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11

List of contributors:

, In: Design, Principle and Application of Self-Assembled Nanobiomaterials in Biology and Medicine,
 
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12

A Passivity based Approach to Synchronize Multi-agent Syste..:

, In: IECON 2022 – 48th Annual Conference of the IEEE Industrial Electronics Society,
Taslima, Eram ; Singh, Bhawana ; Pandey, Vinay... - p. 1-6 , 2022
 
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13

Modeling of Cu-Cu Thermal Compression Bonding:

, In: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC),
Shie, Kai-Cheng ; Tran, Dinh-Phuc ; Gusak, A. M.... - p. 2201-2205 , 2022
 
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14

Contributors:

, In: Innovations in Thermochemical Technologies for Biofuel Processing,
 
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15

Non-Oxidative Toluene Conversion Using a Rotating Arc React..:

, In: 2022 IEEE International Conference on Plasma Science (ICOPS),
Jung, C. ; Dinh, D. K. ; Kim, Y.-N.. - p. 1-1 , 2022
 
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