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Gouraud, C.
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1

In situ Post Etch Treatment on Ge-rich GST after etching in..:

, In: 2023 IEEE International Interconnect Technology Conference (IITC) and IEEE Materials for Advanced Metallization Conference (MAM)(IITC/MAM),
Boixaderas, C. ; Canvel, Y. ; Fontaine, B.... - p. 1-3 , 2023
Link: https://doi.org/10.1109/..
 
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2

$1.62\mu \mathrm{m}$ Global Shutter Quantum Dot Image Senso..:

, In: 2021 IEEE International Electron Devices Meeting (IEDM),
Steckel, J. S. ; Josse, E. ; Pattantyus-Abraham, A. G.... - p. 23.4.1-23.4.4 , 2021
Link: https://doi.org/10.1109/..
 
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3

List of Contributors:

, In: Neuroergonomics,
Agbangla, Nounagnon F. ; Agrali, Atahan ; Albinet, Cédric T.... - p. xxi-xxvi , 2019
Link: https://doi.org/10.1016/..
 
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4

14nm FDSOI technology for high speed and energy efficient a..:

, In: 2014 Symposium on VLSI Technology (VLSI-Technology): Digest of Technical Papers,
Weber, O. ; Josse, E. ; Andrieu, F.... - p. 1-2 , 2014
Link: https://doi.org/10.1109/..
 
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5

Fully-depleted SOI technology using high-k and single-metal..:

, In: 2007 IEEE International Electron Devices Meeting,
Fenouillet-Beranger, C. ; Todeschini, J. ; Le-Denmat, J.C.... - p. None , 2007
Link: https://doi.org/10.1109/..
 
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6

65nm LP/GP mix low cost platform for multi-media wireless a..:

, In: Proceedings of 35th European Solid-State Device Research Conference, 2005. ESSDERC 2005.,
Tavel, B. ; Duriez, B. ; Gwoziecki, R.... - p. 423,424,425,426 , 2005
Link: https://doi.org/10.1109/..
 
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7

A conventional 45nm CMOS node low-cost platform for general..:

, In: IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004.,
Boeuf, F. ; Arnaud, F. ; Basso, M.T.... - p. 425,426,427,428 , 2004
Link: https://doi.org/10.1109/..
 
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