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Hung, Chin-Chang
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1

The Effect of Wooden Floor Processing Procedures on Product..:

, In: Lecture Notes in Electrical Engineering; Genetic and Evolutionary Computing,
Wang, Tien-Chin ; Hung, Tzu-Lien ; Yu, Jiunn-Ming - p. 480-492 , 2024
Link: https://doi.org/10.1007/..
 
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2

AMP-BiLSTM: An Enhanced Highlight Extraction Method Using M..:

, In: 2024 IEEE 18th International Conference on Semantic Computing (ICSC),
Lin, Sheng-Jie ; Chen, Chien Chin ; Chang, Yung-Chun - p. 9-16 , 2024
Link: https://doi.org/10.1109/..
 
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3

Dairy Cow Behavior Recognition Technology Based on Machine ..:

, In: Lecture Notes in Electrical Engineering; Genetic and Evolutionary Computing,
Chou, Che-Wei ; Lee, Chang-Ang ; Guo, Shu-Wei.. - p. 381-391 , 2024
Link: https://doi.org/10.1007/..
 
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4

Electrical Characterization and Reliability Studies of Nano..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Tseng, Ya-Ching ; Chui, King-Jien ; Goh, Simon Chun Kiat... - p. 1581-1586 , 2024
Link: https://doi.org/10.1109/..
 
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5

Study of Frequency Capability of 1.7kV SiC MOSFET with Curr..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Chen, Hua-Mao ; Shen, Shih-Chiang ; Yen, Chih-Hung... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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6

Case Classification System Based on Taiwanese Civil Summary..:

, In: Frontier Computing on Industrial Applications Volume 4; Lecture Notes in Electrical Engineering,
Chen, Ming-Yi ; Chang, Jia-Wei ; Lo, Hsiao-Chin. - p. 66-76 , 2024
Link: https://doi.org/10.1007/..
 
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7

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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8

RF modelling and characterization of TSVs and inductive lin..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Sun, Xiao ; Su, Chin-Ya ; chen, Shih-Hung... - p. 754-759 , 2024
Link: https://doi.org/10.1109/..
 
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9

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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10

Investigation into the Impact of Layout Design on Thermal P..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Tang-Yuan ; Chen, Dao-Long ; Chiu, Frank.. - p. 249-250 , 2024
Link: https://doi.org/10.23919..
 
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11

SpotLight: A Hotspot-Greedy, Light-Weighted, and Automated ..:

, In: 2024 25th International Symposium on Quality Electronic Design (ISQED),
Wu, Chin-Wei ; Lee, Yu-Min ; Huang, Pei-Yu... - p. 1-8 , 2024
Link: https://doi.org/10.1109/..
 
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12

The death and life of Jian-Cheng Circle:: a negative lesson..:

, In: Urban Informality and the Built Environment,
Chang, Chin-Wei - p. 141-154 , 2024
Link: https://doi.org/10.2307/..
 
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13

Traumatic Braquial Plexus Injuries:

, In: Orthopaedics and Trauma,
Chien, Hsin-I ; Lin, Mo-Han ; Chen, Lisa Wen-Yu... - p. 361-375 , 2024
Link: https://doi.org/10.1007/..
 
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14

Hierarchically Porous, Diatomite-Based Absorbents Fabricate..:

, In: The Minerals, Metals & Materials Series; TMS 2024 153rd Annual Meeting & Exhibition Supplemental Proceedings,
Li, Li-Chin ; Chang, Haw-Kai ; Lo, Yu-Hsiang. - p. 559-567 , 2024
Link: https://doi.org/10.1007/..
 
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15

200mm GaN-on-Si E-Mode Power HEMTs with Epitaxially Grown p..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Huang, Zhen-Hong ; Chang, Chia-Hao ; Lo, Ting-Chun... - p. 319-322 , 2024
Link: https://doi.org/10.1109/..
 
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