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Hung, Hsiang-Chieh
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1

A VCO-Based Readout ADC for Quasi-Static Sensing Applicatio..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chang, Chia-Hsiang ; Chen, Pang-Cheng ; Cheng, Hsiang-Chi... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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2

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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3

Refining Accuracy: A Quasi-Floating Channel SPICE Model for..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Hsu, Fu-Jen ; Chang, Ting-Fu ; Hung, Hsiang-Ting.. - p. 72-75 , 2024
Link: https://doi.org/10.1109/..
 
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4

VRDMG: Vocal Restoration via Diffusion Posterior Sampling w..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Hernandez-Olivan, Carlos ; Saito, Koichi ; Murata, Naoki... - p. 596-600 , 2024
Link: https://doi.org/10.1109/..
 
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5

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
Link: https://doi.org/10.1109/..
 
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6

Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Li, Chen-Ning ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 109-110 , 2024
Link: https://doi.org/10.23919..
 
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7

Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Huai-En ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 816-820 , 2024
Link: https://doi.org/10.1109/..
 
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8

A 28nm Energy-Area-Efficient Row-based pipelined Training A..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Lu, Wei ; Pei, Han-Hsiang ; Yu, Jheng-Rong.. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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9

2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Su..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Varma, Anshul ; Gururajarao, Sumanth ; Chen, HsinChen... - p. 36-38 , 2024
Link: https://doi.org/10.1109/..
 
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10

Using Virtual Reality to Enhance Agricultural Value of Came..:

, In: 2024 IEEE 7th Eurasian Conference on Educational Innovation (ECEI),
Hsieh, Yun-Hsiang ; Tsai, Hung-Cheng - p. 355-358 , 2024
Link: https://doi.org/10.1109/..
 
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11

Small Leak Detection in Pipelines Using Deep Learning and S..:

, In: 2024 IEEE 13th Data Driven Control and Learning Systems Conference (DDCLS),
Liang, Yu-Chen ; Cheng, Yi-Hsiang ; Hung, Zhen-Yu. - p. 2133-2138 , 2024
Link: https://doi.org/10.1109/..
 
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12

Design and Implementation of CWMP-Enabled Multipath Managem..:

, In: NOMS 2024-2024 IEEE Network Operations and Management Symposium,
Huang, Wei-Zhi ; Chang, Yu-En ; Lin, Yu-Hsiang. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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13

New Compensation Strategy of the Active Power Filter Integr..:

, In: 2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia),
Wu, Tsai-Fu ; Chiu, Jui-Yang ; Hung, Chien-Chih. - p. 66-69 , 2024
Link: https://doi.org/10.1109/..
 
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14

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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15

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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