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Frontier Computing on Industrial Applications Volume 4; Lecture Notes in Electrical Engineering ,
1
Case Classification System Based on Taiwanese Civil Summary..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
2
Simultaneously Public and Private Wireless IoT System for M..:
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2024 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS) ,
3
Accel-Bench: Exploring the Potential of Programming Using H..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
4
A 28nm Energy-Area-Efficient Row-based pipelined Training A..:
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2024 International Conference on Electronics Packaging (ICEP) ,
5
Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
6
8.11 A 48V-to-5V Buck Converter with Triple EMI Suppression..:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
7
Music Source Separation With Band-Split Rope Transformer:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
8
A Novel Gate Driver with Charge Sharing Technique to Optimi..:
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2024 IEEE Silicon Photonics Conference (SiPhotonics) ,
9
OFDR characterization of silicon wavelength (de)multiplexer..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
10
21.4 A -108dBc THD+N, 2.3mW Class-H Headphone Amplifier wit..:
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2024 10th International Conference on Applied System Innovation (ICASI) ,
11
Integrating Non-Matching Audio Distance Loss to the CMGAN S..:
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Companion Proceedings of the ACM on Web Conference 2024 ,
12
Contrastive Disentanglement for Authorship Attribution:
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Companion Proceedings of the ACM on Web Conference 2024 ,
13
Rankitect: Ranking Architecture Search Battling World-class..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
14
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2024 IEEE Wireless Power Technology Conference and Expo (WPTCE) ,
15