Lo, Tsung-Tien
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1

A New ICT Architecture of Smart Water Network Platform for ..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Li, Chien-Hsing ; Chou, Hao-Tien ; Wu, Chun-I. - p. 157-159 , 2024
 
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2

Effects of Channel Thickness on DC/RF Performance of InAlGa..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Shieh, De ; Lee, Zheng-Fong ; Lee, Ming-Yuan... - p. 1-2 , 2024
 
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3

An Efficient Anomalous Sound Detection by Robust Processing..:

, In: 2024 IEEE 6th International Conference on AI Circuits and Systems (AICAS),
Tsai, Tsung-Lin ; Lo, Yi-Cheng ; Wu, An-Yeu Andy - p. 268-272 , 2024
 
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4

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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5

34.4 A 3nm, 32.5TOPS/W, 55.0TOPS/mm2 and 3.78Mb/mm2 Fully-D..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Fujiwara, Hidehiro ; Mori, Haruki ; Zhao, Wei-Chang... - p. 572-574 , 2024
 
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6

Effect of Passivation on BEOL-Compatible Oxide Semiconducto..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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7

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
 
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8

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
 
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9

Benign Neoplasms of the Small Intestines:

, In: Atlas of Small Intestinal Disorders,
 
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10

Cross-Cultural Validation and Psychometric' Evaluation of t..:

, In: Advancing Sports and Exercise via Innovation; Lecture Notes in Bioengineering,
 
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11

Aggressively Scaled Atomic Layer Deposited Amorphous InZnOx..:

, In: 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits),
 
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12

A 22nm 8Mb STT-MRAM Near-Memory-Computing Macro with 8b-Pre..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Chiu, Yen-Cheng ; Khwa, Win-San ; Li, Chung-Yuan... - p. 496-498 , 2023
 
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13

First Demonstration of Highly Scaled Atomic Layer Deposited..:

, In: 2023 International Electron Devices Meeting (IEDM),
Liang, Yan-Kui ; Zheng, Jun-Yang ; Lin, Yu-Lon... - p. 1-4 , 2023
 
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14

A Nonvolatile Al-Edge Processor with 4MB SLC-MLC Hybrid-Mod..:

, In: 2023 IEEE International Solid- State Circuits Conference (ISSCC),
Huang, Wei-Hsing ; Wen, Tai-Hao ; Hung, Je-Min... - p. 15-17 , 2023
 
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15

A Time-Domain CCM/DCM Current-Mode Buck Converter with a PI..:

, In: ESSCIRC 2023- IEEE 49th European Solid State Circuits Conference (ESSCIRC),
Chiu, Mao-Ling ; Lo, I-Fang ; Lin, Tsung-Hsien - p. 441-444 , 2023
 
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