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2024 IEEE/ACM 46th International Conference on Software Engineering (ICSE) ,
1
Exploiting Library Vulnerability via Migration Based Automa..:
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2024 IEEE/ACM 46th International Conference on Software Engineering (ICSE) ,
2
MUT: Human-in-the-Loop Unit Test Migration:
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Frontier Computing on Industrial Applications Volume 4; Lecture Notes in Electrical Engineering ,
3
Case Classification System Based on Taiwanese Civil Summary..:
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Lecture Notes in Electrical Engineering; Frontier Computing on Industrial Applications Volume 3 ,
4
Improving Interoperability in Healthcare: A User-Friendly I..:
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Proceedings of the IEEE/ACM 46th International Conference on Software Engineering ,
5
Exploiting Library Vulnerability via Migration Based Automa..:
, In:
?
Proceedings of the IEEE/ACM 46th International Conference on Software Engineering ,
6
MUT: Human-in-the-Loop Unit Test Migration:
, In:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
7
Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
8
Fine Pitch and Low Temperature Nanocrystalline-Nanotwinned ..:
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2024 IEEE International Workshop on Antenna Technology (iWAT) ,
9
Restoration Strategies for the Radiation Pattern of a 5G mm..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
10
Effect of Passivation on BEOL-Compatible Oxide Semiconducto..:
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2024 IEEE International Conference on Software Analysis, Evolution and Reengineering (SANER) ,
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Self-Admitted Technical Debts Identification: How Far Are W..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
12
34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:
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Lecture Notes in Electrical Engineering; Frontier Computing on Industrial Applications Volume 3 ,
13
Development of an Artificial Intelligence-Based Precise Nut..:
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2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA) ,
14
U-MRAM PUF: A Novel Unipolar-MRAM for Power and Area Effici..:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
15