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Tsai, Su-Ying
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1

Development of Rapid-Setting Repair Materials Through One-P..:

, In: Lecture Notes in Civil Engineering; Proceedings of the 3rd International Civil Engineering and Architecture Conference,
Lee, Wei-Hao ; Tsai, Ying-Kuan ; Chen, Chien-Chin. - p. 145-156 , 2024
Link: https://doi.org/10.1007/..
 
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2

8.11 A 48V-to-5V Buck Converter with Triple EMI Suppression..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Kao, Yi-Hsiang ; Hung, Chieh-Sheng ; Chang, Hui-Hsuan... - p. 164-166 , 2024
Link: https://doi.org/10.1109/..
 
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3

North America and Caribbean region: USA:

, In: Rehabilitation Robots for Neurorehabilitation in High-, Low-, and Middle-Income Countries,
Mendonca, Rochelle J. ; Wamsley, Carol A. ; Owen Tsai, Chung-Ying.. - p. 97-115 , 2024
Link: https://doi.org/10.1016/..
 
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4

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
Link: https://doi.org/10.1109/..
 
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5

Experimental and Numerical Investigation on Carbon Fiber Re..:

, In: Lecture Notes in Civil Engineering; Proceedings of the 3rd International Civil Engineering and Architecture Conference,
Kuo, Chang-Yu ; Tsai, Ying-Kuan ; Li, Yeou-Fong - p. 35-44 , 2024
Link: https://doi.org/10.1007/..
 
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6

Research of Impedance Optimization with Mesh Reference Grou..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Lin, Shu-Yu ; Wu, Shin-Shian ; Su, Yu-Ming.. - p. 1-2 , 2024
Link: https://doi.org/10.23919..
 
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7

Low Temperature Cu/SiO2 Hybrid Bonding Using Area-Selective..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Mu-Ping ; Tsai, Wen-Tsu ; Lee, Ou-Hsiang... - p. 2131-2135 , 2024
Link: https://doi.org/10.1109/..
 
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8

31.4 98.7% Efficiency 1200V-to-48V LLC Converter with CC/CV..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wang, Tz-Wun ; Hung, Sheng-Hsi ; Chiu, Po-Jui... - p. 502-504 , 2024
Link: https://doi.org/10.1109/..
 
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9

The Importance of Contextual Grounding in Affective Mediate..:

, In: 2024 IEEE Haptics Symposium (HAPTICS),
Zhu, Xin ; Su, Zhenghui ; Tsai, Jocelyn.. - p. 91-97 , 2024
Link: https://doi.org/10.1109/..
 
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10

"I Know I'm Being Observed:" Video Interventions to Educate..:

, In: Proceedings of the CHI Conference on Human Factors in Computing Systems,
Smith, Garrett ; Carson, Sarah ; Vengurlekar, Rhea G... - p. 1-27 , 2024
Link: https://dl.acm.org/doi/1..
 
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11

List of contributors:

, In: Rehabilitation Robots for Neurorehabilitation in High-, Low-, and Middle-Income Countries,
Ad Adams, Ebenezer ; Adebowale, Akintunde ; Agrawal, Abha... - p. xxi-xxviii , 2024
Link: https://doi.org/10.1016/..
 
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12

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Ouyang, Tsung- Yu ; Lin, Yu-Min ; Chan, Yu-Ping... - p. 1-2 , 2024
Link: https://doi.org/10.1109/..
 
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13

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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14

A Study on the Surface Activation of Plasma Treatment for H..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Hsu, Chih-Jing ; Fang, Hsu-Nan ; Su, Tzu-Yu... - p. 1826-1829 , 2024
Link: https://doi.org/10.1109/..
 
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15

200mm GaN-on-Si E-Mode Power HEMTs with Epitaxially Grown p..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Huang, Zhen-Hong ; Chang, Chia-Hao ; Lo, Ting-Chun... - p. 319-322 , 2024
Link: https://doi.org/10.1109/..
 
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