Tseng, Chun-Hsiang
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1

A VCO-Based Readout ADC for Quasi-Static Sensing Applicatio..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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2

Transformer-Based Semantic SBERT Robot with CI Mechanism fo..:

, In: 2024 IEEE International Conference on Fuzzy Systems (FUZZ-IEEE),
 
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3

Benefits of Combining Gate-Field Plates Design and Hybrid D..:

, In: 2024 31st International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD),
Chen, Yen-Shuo ; Lai, Yuwen ; Lin, Zhe- Yu... - p. 136-139 , 2024
 
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4

GaP-Aug: Gamma Patch-Wise Correction Augmentation Method fo..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Chang, An-Yan ; Tzeng, Jing-Tong ; Chen, Huan-Yu... - p. 551-555 , 2024
 
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5

Low Temperature (250°C) and Fine Pitch (≤4 μ m) New Nanocry..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Lin, Ang-Ying ; Lin, Yu-Min ; Lu, Chun-Lin... - p. 1-2 , 2024
 
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6

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
 
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7

Training Process of Memristor-Based Spiking Neural Networks..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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8

Navigating the Design Implications for Integrating Virtual-..:

, In: Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems,
 
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9

Alignment and Transfer of Silver Nanowire Arrays onto Uncon..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Chen, Yen-Shuo ; Liu, Shun-Yu ; Lin, Ching-Chang... - p. 255-256 , 2024
 
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10

Highly Reliable PUF Circuits Using Efficient Post-Processin..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
 
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11

Satisfiability Modulo Theories-Based Qubit Mapping for Trap..:

, In: Proceedings of the 2024 International Symposium on Physical Design,
 
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12

Thin-Film Terahertz Metamaterials Manufactured by Laser Dir..:

, In: 2024 18th European Conference on Antennas and Propagation (EuCAP),
 
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13

Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer B..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
 
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14

Machine Vision Observation, Artificial Intelligence Pattern..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Chen, Cheng-Shan ; Yang, Chun-Yen ; Yang, Shao-Jui... - p. 10B.5-1-10B.5-7 , 2024
 
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15

Layout Guidelines against Charging Damage from the Well-Sid..:

, In: 2024 IEEE International Reliability Physics Symposium (IRPS),
Kuo, Hsi-Yu ; Chu, Yu-Lin ; Dai, Hung-Da... - p. 1-6 , 2024
 
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