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Wang, Han-Hsiang
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1

15.9 A 16nm 16Mb Embedded STT-MRAM with a 20ns Write Time, ..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Lin, Ku-Feng ; Noguchi, Hiroki ; Shih, Yi-Chun... - p. 292-294 , 2024
Link: https://doi.org/10.1109/..
 
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2

Developing a BIM- and VR-based system to Enhance Layout Mod..:

, In: 2024 the 8th International Conference on Virtual and Augmented Reality Simulations (ICVARS),
Tai, Jung-Hsing ; Wang, Kun-Chi ; Chen, Guan-Yu. - p. 8-12 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

Thin-Film Terahertz Metamaterials Manufactured by Laser Dir..:

, In: 2024 18th European Conference on Antennas and Propagation (EuCAP),
Cheng, Yin-Han ; Hu, Kai-Chun ; Lin, Chih-Han. - p. 1-4 , 2024
Link: https://doi.org/10.23919..
 
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4

2.1 A 4nm 3.4GHz Tri-Gear Fully Out-of-Order ARMv9.2 CPU Su..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Varma, Anshul ; Gururajarao, Sumanth ; Chen, HsinChen... - p. 36-38 , 2024
Link: https://doi.org/10.1109/..
 
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5

PPVR: A Privacy-Preserving Approach for User Behaviors in V:

, In: 2024 IEEE Conference on Virtual Reality and 3D User Interfaces Abstracts and Workshops (VRW),
Sun, Ruoxi ; Wang, Hanwen ; Xue, Minhui. - p. 1055-1056 , 2024
Link: https://doi.org/10.1109/..
 
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6

On DRC Cleanness of Cell Porting for Design Migrations in F..:

, In: 2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA),
Wang, Ching-Ying ; Chen, Chen-Ho ; Chang, Po-Hsiang... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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7

Contributors:

, In: Federated Learning,
Agussurja, Lucas ; Aramoon, Omid ; Arora, Sanjeev... - p. xvii-xxi , 2024
Link: https://doi.org/10.1016/..
 
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8

Adaptive 3D UI Placement in Mixed Reality Using Deep Reinfo..:

, In: Extended Abstracts of the 2024 CHI Conference on Human Factors in Computing Systems,
Lu, Feiyu ; Chen, Mengyu ; Hsu, Hsiang... - p. 1-7 , 2024
Link: https://dl.acm.org/doi/1..
 
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9

Thermal resistance prediction model for IC packaging optimi..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Guan-Wei ; Lin, Yan-Cheng ; Hsu, Chung-Hsiang... - p. 1593-1598 , 2024
Link: https://doi.org/10.1109/..
 
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10

Using Graph Neural Network to Ransomware Detection for Cybe..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Hsiao-Chung ; Wang, Ping ; Lin, Wen-Hui... - p. 314-316 , 2024
Link: https://doi.org/10.1109/..
 
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11

A Novel Detection Applied on Micro Defect in Bump Interface..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Yi-Sheng ; Hsiao, Yu-Hsiang ; Liu, Cheng-Hsin... - p. 1804-1807 , 2024
Link: https://doi.org/10.1109/..
 
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12

Towards System-Friendly Solid-State Circuit Breaker for Ele..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Qin, Dehao ; Zhang, Zheyu ; Dam, Shimul K... - p. 3108-3114 , 2024
Link: https://doi.org/10.1109/..
 
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13

A 28nm Energy-Area-Efficient Row-based pipelined Training A..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Lu, Wei ; Pei, Han-Hsiang ; Yu, Jheng-Rong.. - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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14

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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15

Metapunch X: Combing Multidisplay and Exertion Interaction ..:

, In: ACM SIGGRAPH 2024 Immersive Pavilion,
Chang, Kuan-Ning ; Lin, Chia-Hui ; Weng, Yu-Hsiang... - p. 1-2 , 2024
Link: https://dl.acm.org/doi/1..
 
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