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Wang, Hsiao-Yu
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1

A Compact AiP with a Dual-Polarized 1x4 Antenna Array for 5..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Hsieh, Sheng-Chi ; Huang, Hong-Sheng ; Hsiao, Wen-Chun... - p. 189-190 , 2024
Link: https://doi.org/10.23919..
 
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2

Neural Network Acceleration Using Digit-Plane Computation w..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Hsiao, Shen-Fu ; Kuo, Hou-Chun ; Kuo, Yu. - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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3

Performance and Analysis of Superconducting Resistive Fault..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Tun ; San, Moe Moe ; Htet, Soe Min.. - p. 52-54 , 2024
Link: https://doi.org/10.1109/..
 
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4

Semi-classical Spectral Asymptotics of Toeplitz Operators o..:

, In: The Bergman Kernel and Related Topics; Springer Proceedings in Mathematics & Statistics,
Hsiao, Chin-Yu ; Marinescu, George - p. 239-259 , 2024
Link: https://doi.org/10.1007/..
 
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5

A Special Holding System for Large Package in 3D X-Ray Insp..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Huang, Chia-Ju ; Hsiao, Yu-Hsiang ; Lin, Yi-Sheng. - p. 231-232 , 2024
Link: https://doi.org/10.23919..
 
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6

A Study on Native Mandarin Speakers' Homogeneity of Degree ..:

, In: Lecture Notes in Computer Science; Chinese Lexical Semantics,
Hsiao, Huichen S. ; Wang, Yunhan ; Yu, Anwei - p. 3-10 , 2024
Link: https://doi.org/10.1007/..
 
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7

The LoD Enhancement Study of MIP-Based Troponin T in Urine ..:

, In: 2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS),
Chen, Chieh ; Tsai, Cheng-Yu ; Cheng, Yu-Ting.. - p. 312-315 , 2024
Link: https://doi.org/10.1109/..
 
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8

Designing Autonomous Vehicle Interactions for a Super-Aged ..:

, In: Lecture Notes in Computer Science; Human Aspects of IT for the Aged Population,
Chang, Jack Shen-Kuen ; Chen, Pin-Chun ; Ma, Hsin-Tzu... - p. 151-167 , 2024
Link: https://doi.org/10.1007/..
 
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9

A Machine Learning Study to Obtain an Optimal Processing Pu..:

, In: 2024 Conference of Science and Technology for Integrated Circuits (CSTIC),
Tseng, Xue-Li ; Chen, Yu-Shin ; Chen, Hsuan-Fan... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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10

Test Compression for Neuromorphic Chips:

, In: 2024 IEEE European Test Symposium (ETS),
Chen, Xin-Ping ; Huang, Hsu-Yu ; Hsiao, Chu-Yun.. - p. 1-6 , 2024
Link: https://doi.org/10.1109/..
 
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11

Using Graph Neural Network to Ransomware Detection for Cybe..:

, In: 2024 10th International Conference on Applied System Innovation (ICASI),
Lin, Hsiao-Chung ; Wang, Ping ; Lin, Wen-Hui... - p. 314-316 , 2024
Link: https://doi.org/10.1109/..
 
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12

A Preliminary Study on Japanese CSL Learners' Acquisition o..:

, In: Lecture Notes in Computer Science; Chinese Lexical Semantics,
Yu, Anwei ; Hsiao, Huichen S. - p. 423-434 , 2024
Link: https://doi.org/10.1007/..
 
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13

An Advanced Packaging Figure of Merit (AP-FoM) for Benchmar..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Wang, Chuei-Tang ; Shang, Shu-An ; Hsiao, Yu-Ming... - p. 1093-1097 , 2024
Link: https://doi.org/10.1109/..
 
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14

Low-Temperature Nanocrystalline Cu/polymer Hybrid Bonding w..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lee, Ou-Hsiang ; Chiu, Wei-Lan ; Chang, Hsiang-Hung... - p. 1863-1867 , 2024
Link: https://doi.org/10.1109/..
 
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15

High Performance Antenna-in-Package with Test Socket for Mi..:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Ho, Cheng-Yu ; Hsiao, Wen-Chun ; Hsieh, Sheng-Chi.. - p. 191-192 , 2024
Link: https://doi.org/10.23919..
 
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