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Ye, Chih-Hung
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1

The Constraint Artificial-Intelligence Assisted Method for ..:

, In: 2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC),
Yang, Zusing ; Liang, Ying-Hung ; Tsai, Cheng-En... - p. 1-4 , 2024
Link: https://doi.org/10.1109/..
 
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2

AN INTELLIGENT SHOPPING-GUIDE SYSTEM BASED ON THE AIDA RULE:

, In: Proceedings of the 2024 International Conference on Information Technology, Data Science, and Optimization,
Hung, Lun-Ping ; Tsai, Wen-Lung ; Yeh, Ming-Kuei.. - p. 57-60 , 2024
Link: https://dl.acm.org/doi/1..
 
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3

FincGAN: A Gan Framework of Imbalanced Node Classification ..:

, In: ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP),
Hsu, Hung Chun ; Lin, Ting-Le ; Wu, Bo-Jun... - p. 5750-5754 , 2024
Link: https://doi.org/10.1109/..
 
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4

Refining Accuracy: A Quasi-Floating Channel SPICE Model for..:

, In: 2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD),
Hsu, Fu-Jen ; Chang, Ting-Fu ; Hung, Hsiang-Ting.. - p. 72-75 , 2024
Link: https://doi.org/10.1109/..
 
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5

Void Migration Kinetics in Fine Line Cu RDL under Electric ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Huang, Yen-Cheng ; Tsai, Min-Yan ; Lin, Ting-Chun... - p. 576-580 , 2024
Link: https://doi.org/10.1109/..
 
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6

Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Huai-En ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 816-820 , 2024
Link: https://doi.org/10.1109/..
 
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7

Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Li, Chen-Ning ; Ong, Jia-Juen ; Chiu, Wei-Lan... - p. 1312-1316 , 2024
Link: https://doi.org/10.1109/..
 
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8

High Acceleration Dynamic Methodology for Board-Level Shock..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Yu, Min-Cheng ; Wu, Nan-Yi ; Wang, Wu-Lung... - p. 1213-1218 , 2024
Link: https://doi.org/10.1109/..
 
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9

Performance Comparison of Direct Digital Control and DQ-bas..:

, In: 2024 IEEE Applied Power Electronics Conference and Exposition (APEC),
Wu, Tasi-Fu ; Hung, Chien-Chih ; Kumari, Anumeha.. - p. 1888-1892 , 2024
Link: https://doi.org/10.1109/..
 
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10

A VCO-Based Readout ADC for Quasi-Static Sensing Applicatio..:

, In: 2024 IEEE International Symposium on Circuits and Systems (ISCAS),
Chang, Chia-Hsiang ; Chen, Pang-Cheng ; Cheng, Hsiang-Chi... - p. 1-5 , 2024
Link: https://doi.org/10.1109/..
 
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11

Evaluation of Vapor Pressure Induced Debonding Failure in F..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Chen, Bo-Shuo ; Chiu, Tz-Cheng ; Yin, Wei-Jie.. - p. 150-156 , 2024
Link: https://doi.org/10.1109/..
 
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12

34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:

, In: 2024 IEEE International Solid-State Circuits Conference (ISSCC),
Wen, Tai-Hao ; Hsu, Hung-Hsi ; Khwa, Win-San... - p. 580-582 , 2024
Link: https://doi.org/10.1109/..
 
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13

Private Graphon Estimation via Sum-of-Squares:

, In: Proceedings of the 56th Annual ACM Symposium on Theory of Computing,
Chen, Hongjie ; Ding, Jingqiu ; D'Orsi, Tommaso... - p. 172-182 , 2024
Link: https://dl.acm.org/doi/1..
 
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14

Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Li, Chen-Ning ; Chiu, Wei-Lan ; Chang, Hsiang-Hung. - p. 109-110 , 2024
Link: https://doi.org/10.23919..
 
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15

Air Pollution Source Tracing Framework: Leveraging Microsen..:

, In: Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence,
Hung, Chih-Chieh ; Hsiao, Hong-En ; Lin, Chuang-Chieh. - p. 142-154 , 2024
Link: https://doi.org/10.1007/..
 
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