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2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) ,
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The Constraint Artificial-Intelligence Assisted Method for ..:
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Proceedings of the 2024 International Conference on Information Technology, Data Science, and Optimization ,
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AN INTELLIGENT SHOPPING-GUIDE SYSTEM BASED ON THE AIDA RULE:
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ICASSP 2024 - 2024 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP) ,
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FincGAN: A Gan Framework of Imbalanced Node Classification ..:
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2024 36th International Symposium on Power Semiconductor Devices and ICs (ISPSD) ,
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Refining Accuracy: A Quasi-Floating Channel SPICE Model for..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Void Migration Kinetics in Fine Line Cu RDL under Electric ..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Observation of Thermal Expansion Behavior of Nanotwinned-Cu..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Low-Temperature Cu-Cu Bonding Using -oriented and Nanocryst..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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High Acceleration Dynamic Methodology for Board-Level Shock..:
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2024 IEEE Applied Power Electronics Conference and Exposition (APEC) ,
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Performance Comparison of Direct Digital Control and DQ-bas..:
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2024 IEEE International Symposium on Circuits and Systems (ISCAS) ,
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A VCO-Based Readout ADC for Quasi-Static Sensing Applicatio..:
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC) ,
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Evaluation of Vapor Pressure Induced Debonding Failure in F..:
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2024 IEEE International Solid-State Circuits Conference (ISSCC) ,
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34.8 A 22nm 16Mb Floating-Point ReRAM Compute-in-Memory Mac..:
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Proceedings of the 56th Annual ACM Symposium on Theory of Computing ,
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Private Graphon Estimation via Sum-of-Squares:
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2024 International Conference on Electronics Packaging (ICEP) ,
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Low-Temperature Cu-Cu Bonding using Nanocrystalline Grains:
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Communications in Computer and Information Science; Technologies and Applications of Artificial Intelligence ,
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