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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
6
Effect of Underfill on Substrate Trace Crack under PTC:
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) ,
9
Design Optimization to Boost Solder Joint Reliability Perfo..:
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2023 International Conference on Emerging Power Technologies (ICEPT) ,
10