Ho, Teck H.
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3

A Compact Wafer-Level Heterogeneously Integrated Scalable O..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar Wit..:

Sun, Mei ; Guan Lim, Teck ; Soon Wee Ho, David...
IEEE Transactions on Components, Packaging and Manufacturing Technology.  14 (2024)  4 - p. 537-546 , 2024
 
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Multistate Compound Magnetic Tunnel Junction Synapses for D..:

Kumar, Anuj ; Lin, Dennis J. X. ; Das, Debasis...
ACS Applied Materials & Interfaces.  16 (2024)  8 - p. 10335-10343 , 2024
 
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11

Comprehensive IoT-Based Monitoring System for Improving Wor..:

, In: 2024 International Conference on Green Energy, Computing and Sustainable Technology (GECOST),
Benny, Wan Jasmine ; Chew, Ing Ming ; Wong, W. K.... - p. 87-93 , 2024
 
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High-Performance 3D Concrete Printing with Zeolite:

, In: Construction 3D Printing; Springer Tracts in Additive Manufacturing,
Lu, Bing ; Li, Mingyang ; Qian, Shunzhi.. - p. 149-155 , 2024
 
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14

List of contributors:

, In: Rehabilitation Robots for Neurorehabilitation in High-, Low-, and Middle-Income Countries,
Ad Adams, Ebenezer ; Adebowale, Akintunde ; Agrawal, Abha... - p. xxi-xxviii , 2024
 
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