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2023 International Conference on Electronics Packaging (ICEP) ,
4
Stress relaxation structure using Ni nano-particle/Al micro..:
, In:
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Lecture Notes in Electrical Engineering; Emerging Electronic Devices, Circuits and Systems ,
5
Origin of Hump in Ids for Body-Tied SOI-MOSFET and Its Infl..:
, In:
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2023 International Electron Devices Meeting (IEDM) ,
9