Jhong, Ming-Fong
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1

High Speed D2D Interface Applied on Advanced Package:

, In: 2024 International Conference on Electronics Packaging (ICEP),
Wang, Chen Chao ; Huang, Chih Yi ; Kuo, Hung Chun... - p. 269-270 , 2024
 
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5

Geometric error compensation method using the Laser R-test:

Hsieh, Tung-Hsien ; Jywe, Wen-Yuh ; Zeng, Jheng-Jhong..
The International Journal of Advanced Manufacturing Technology.  131 (2024)  7-8 - p. 4035-4053 , 2024
 
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10

Creative Design and Structure Applied to Chiplets Packaging:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Wang, Chen-Chao ; Huang, Chih-Yi ; Kuo, Hung-Chun... - p. 1353-1358 , 2023
 
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11

A Low-Cost Antenna-in-Package (AiP) for D-Band Application:

, In: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC),
Kuo, Hung-Chun ; Wu, Po-I ; Jhong, Ming-Fong.. - p. 481-486 , 2023
 
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15

Mitigate Package Level Crosstalk Using Tabbed Design:

, In: 2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT),
 
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