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2024 International Conference on Electronics Packaging (ICEP) ,
1
High Speed D2D Interface Applied on Advanced Package:
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2023 IEEE CPMT Symposium Japan (ICSJ) ,
9
Crosstalk Mitigation for High Speed SerDes Applications on ..:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
10
Creative Design and Structure Applied to Chiplets Packaging:
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ,
11
A Low-Cost Antenna-in-Package (AiP) for D-Band Application:
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2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ,
15