Jourdain, Anne
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1

Identification of a novel CFAP61 homozygous splicing varian..:

Barbotin, Anne-Laure ; Boursier, Angèle ; Jourdain, Anne-Sophie...
Journal of Assisted Reproduction and Genetics.  41 (2024)  6 - p. 1499-1505 , 2024
 
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Block level and package level thermal assessment for back s..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lofrano, Melina ; Oprins, Herman ; Cherman, Vladimir... - p. 1036-1043 , 2024
 
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3

3D interconnects for quantum computing:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
 
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4

Impact of Sub-μm Wafer Thinning on Latch-Up Risk in DTCO/ST..:

Serbulova, Kateryna ; Chen, Shih-Hung ; Hellings, Geert...
IEEE Transactions on Electron Devices.  71 (2024)  4 - p. 2278-2283 , 2024
 
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Direct Die-to-Wafer Hybrid Bonding Using Plasma Diced Dies ..:

, In: 2024 IEEE 74th Electronic Components and Technology Conference (ECTC),
Lin, Ye ; Bex, Pieter ; Kennes, Koen... - p. 40-44 , 2024
 
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9

Thomas Coutrot et Coralie Perez, Redonner du sens au travai..:

Jourdain, Anne
Prix des jeunes auteurices 2023; Sociologie du travail.  66 (2024)  2 - p. , 2024
 
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14

A recurrent de novo missense mutation in COL1A1 causes oste..:

Corbeau, Julien ; Grohs, Cécile ; Jourdain, Jeanlin...
info:eu-repo/semantics/altIdentifier/doi/10.1186/s12711-024-00909-3.  , 2024
 
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15

The rising global economic costs of invasive Aedes mosquito..:

Roiz, David, A ; Pontifes, Paulina, A ; Jourdain, Frédéric...
info:eu-repo/semantics/altIdentifier/doi/10.1016/j.scitotenv.2024.173054.  , 2024
 
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